EF Series Power MOSFET with Fast Body Diode Enables High Power Density while Lowering Conduction and Switching Losses
Vishay Intertechnology, Inc has introduced a new fourth-generation 600 V EF Series fast body diode MOSFET in the low-profile PowerPAK 10 x 12 package that provides high efficiency and power density for telecom, industrial, and computing applications.
New ACEPACK Power Modules with SiC MOSFETs Designed for DC/DC Converters
STMicroelectronics has released two new STPOWER modules that use ST’s ACEPACK 2 package technology to ensure high power density and contain 1200V silicon-carbide (SiC) MOSFETs in popular
TNY278 Off-Line Switcher IC
TinySwitch-III TNY278 combines a high voltage power MOSFET switch with a power supply controller in one device.
High-Power SiC MOSFET Dual Modules with Built-in NTC Thermistor designed for Renewable Energy Power Generation Systems
Toshiba Electronic Devices & Storage Corporation has introduced two new SiC MOSFET dual modules that have mounting compatibility with widely used silicon (Si) IGBT modules and their low energy loss characteristics meet needs for higher efficiency and size reductions
New Electromagnetic Buzzer Driving Control IC with Integrated Power MOSFET and Demagnetizing Diode
MORNSUN has launched a new cost-efficient driving controller SCM3560A for electromagnetic buzzer with build-in power MOSFET and a demagnetizing diode. This chip can be applied to SMD and can be used with passive buzzers or replace the active buzzer discrete devices.