Enhanced LFPAK56 and LFPAK88 Packages for Efficient and Low-Spiking Switching

Nexperia has announced the expansion of packaging options for its NextPower 80/100 V MOSFET portfolio. These MOSFETs, previously available only in LFPAK56E, are now also offered in LFPAK56 and LFPAK88 packages, enabling designers to reduce the size of their applications and benefit from the robustness of copper clip packaging.

The new packaging options cater to the requirements of telecommunications, server computing, industrial, power supply, fast charging, USB-PD, and motor control applications, providing high efficiency combined with reduced spiking behavior.

These MOSFETs feature low RDS(on) and a strong avalanche energy rating. The devices exhibit low body diode losses with Qrr as low as 50 nC, resulting in reduced reverse recovery current (Irr), voltage spikes (Vpeak), and ringing, allowing for further optimization of dead time.

Features 

• NextPower 100 V uses deep-trenches and charge-balanced structure (resurf)
• High efficiency and low spiking in switching applications
• Qualified to 175˚C
• LFPAK56 low stress lead-frame and wave-solder compatible
• Low RDS(on) 
• Improved Qg(tot) figure-of-merit (FOM)
• Low Qrr gives high efficiency in switching applications
• Avalanche rated, 100% avalanche tested
• Optimised for switching, low spiking, and high efficiency

Applications

• Synchronous rectifier in flyback and resonant topology
• AC/DC and DC/DC converters
• LED lighting
• Full-bridge and half-bridge topologies
• Motor control
• UPS and Solar inverter

Availability

The N-channel MOSFETs in LFPAK88 and LFPAK56 packages are now available.