Vishay Intertechnology, Inc has introduced a new fourth-generation 600 V EF Series fast body diode MOSFET in the low-profile PowerPAK 10 x 12 package that provides high efficiency and power density for telecom, industrial, and computing applications.
STMicroelectronics has released two new STPOWER modules that use ST’s ACEPACK 2 package technology to ensure high power density and contain 1200V silicon-carbide (SiC) MOSFETs in popular
Toshiba Electronic Devices & Storage Corporation has introduced two new SiC MOSFET dual modules that have mounting compatibility with widely used silicon (Si) IGBT modules and their low energy loss characteristics meet needs for higher efficiency and size reductions
MORNSUN has launched a new cost-efficient driving controller SCM3560A for electromagnetic buzzer with build-in power MOSFET and a demagnetizing diode. This chip can be applied to SMD and can be used with passive buzzers or replace the active buzzer discrete devices.