Toshiba Electronic Devices & Storage Corporation has commenced mass production of its TXZ+™ Family Entry-Class M4L Group of compact microcontrollers. These new devices are…
The ESP32-C3 Super Mini is an ultra-compact, thumb-sized ESP32C3 Mini development board powered by Espressif's single-core ESP32-C3 RISC-V SoC. Featuring integrated 2.4 GHz Wi-Fi…
Torex Semiconductor has introduced the XD9704/XD9705 series, a family of 36 V high-voltage, 600 mA synchronous step-down DC/DC converters designed for automotive applications.…
The RW610FML is presented as a low-power, high-performance Wi-Fi 6 and Bluetooth combo module. It supports a comprehensive range of wireless protocols, including IEEE 802.11a/b/g/…
Quectel Wireless Solutions has launched the FCM665D, a compact Wi-Fi 6 and Bluetooth module built specifically to bring edge AI processing into smart homes and smart building…
Quectel has expanded its wireless connectivity portfolio with the FCE870X and FME170X tri-band Wi-Fi 7 modules, powered by the Synaptics SYN4384 chipset and designed for set-top…
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
Silicon Labs, a leading innovator in low-power wireless connectivity, has unveiled the BG2B, its next Series 2 Bluetooth Low Energy (LE) wireless SoC. This new system-on-chip is…
Analog Devices has significantly enhanced its RF/microwave component portfolio by introducing the ADRF5703 silicon digital attenuator. This innovative product is specifically…
ESP32-S31 Now in Mass Production and Available for Purchase
Espressif Systems (SSE: 688018) announces that its ESP32-S31 has entered mass production and is now available for purchase. Designed for next-generation AIoT applications, the…