ROHM has introduced the BM6437x series that includes four new 600V IGBT Intelligent Power Modules (IPMs) that can deliver best-in-class low noise characteristics together with low loss ideal for power conversion in inverters.
Upgrading its EasyDUAL CoolSiC MOSFET modules, Infineon Technologies has released two new aluminum nitride (AIN) ceramic that enable increased power density and more compact designs.
Dialog Semiconductor has introduced the AT25EU family of SPI NOR Flash devices, to support the development of power-conscious, size-constrained connected devices. The new device achieves low energy consumption without sacrificing performance.
CISSOID has added new liquid-cooled modules to its growing platform of 3-Phase Silicon Carbide (SiC) MOSFET Intelligent Power Module (IPM) products for E-mobility tailored for lower switching losses or higher power.
The Bourns Model HES38U-RS485 hybrid position sensor based on a combination of magnetic “Hall Effect” non-contacting technology is ideal for the rotational position sensing combined with a long-lasting 10-turn
Infineon Technologies has introduced the F3L11MR12W2M1_B74, a new EasyPACK 2B module to its 1200V family. The module is integrated with CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins.
TDK Corporation has extended its portfolio of components for bidirectional overvoltage protection of I/O interfaces with the introduction of tiny high-power TVS diodes for ESD protection. The space requirement for the new chip-scale package (CSP) is just 400 x 200 µm2 (C
The enhanced TSSP77038 sensor module from Vishay Intertechnology in the Heimdall package offers a storage temperature range of -40 °C to +110 °C and an operating temperature range of -30 °C to +85 °C. When used with Vishay’s TSAL6200 IR em
As an expansion to the positive temperature coefficient (PTC) surface-mount chip thermistors portfolio, Murata has introduced the PRF03BB541NB7RL for overheat sensing.