New Product
High-Efficiency 100V 20A Trench Schottky Rectifiers for Fast Switching Applications
Nexperia has extended the portfolio of Trench Schottky rectifiers with devices rated at up to 100V and 20A for offering excellent behavior and leading thermal performance.
400PV Series of 2410 Photovoltaic Fuse for Reliable Overcurrent Performance in High-Temperature Environment
Littelfuse has released a 400PV Fuse series of 2410 size surface mount design (SMD) circuit protection component that offers low resistance for photovoltaic (PV) applications.
High Performance Proteus-III-SPI Bluetooth Low Energy 5.1 Module for Industrial Applications
Proteus-III-SPI from Würth Elektronik is the Bluetooth Low Energy 5.1 module that is based on the Nordic Semiconductor nRF52840 chipset that offers significantly high performance with a payloa
DMS22B: Non-Contacting Feedback Rotary Sensor with SSI Output for High Reliability and Long Cycle Life in Heavy-Duty Applications
Bourns has introduced the latest non-contacting feedback rotary sensor with Synchronous Serial Interface (SSI) for effective synchronization in closed-loop control systems.
2300V Isolated EiceDRIVER 2L-SRC Compact for Optimizing System Efficiency in Industrial Applications
Infineon Technologies has introduced the latest isolated EiceDriver 2L-SRC Compact (1ED33xx) gate drivers for delivering high efficiency in power electronics applications.
BM6437x Series of 600V IGBT Intelligent Power Modules for Reducing Power Consumption and Design Load in Compact Industrial Equipment
ROHM has introduced the BM6437x series that includes four new 600V IGBT Intelligent Power Modules (IPMs) that can deliver best-in-class low noise characteristics together with low loss ideal for power conversion in inverters.
New High Performing FF11MR12W1M1_B70 and FF6MR12W2M1_B70 EasyDUAL MOSFET Modules to Enable Increased Power Density and Compact Designs
Upgrading its EasyDUAL CoolSiC MOSFET modules, Infineon Technologies has released two new aluminum nitride (AIN) ceramic that enable increased power density and more compact designs.