ADC3660, a new family of successive-approximation register (SAR) analog-to-digital converters (ADCs) has been added by Texas instruments to its portfolio of high-speed data converters.
Intended to offer more choice to power system designers, Infineon Technologies has introduced diverse design options that can offer maximum performance in the smallest space.
The Thermopad Temperature Variable Attenuator, SpaceNXT K2TVA has been introduced by Smiths Interconnect for attaining gain compensation over the temperature in critical space flight applications.
PI2DBS16212A High Bandwidth 2:1 Mux/DeMux Switch IC
Diodes Incorporated extends its passive multiplexer/demultiplexer(mux/demux) switches range with the introduction of PI2DBS16212A, a 4-to-2 differential channel switching IC with up to 20Gbps data rates.
Microchip Technology has introduced the M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), MOSFET for the operation against extreme particle interactions and solar and electromagnetic events in commercial aerospace and defense space applications.
Two new common mode chokes (DLW21SH391XQ2 and DLW21PH201XQ2) have been introduced by Murata for high-speed interfaces that use Serializer/Deserializer(Ser/Der) on Power Over Coax(PoC) for noise suppression.
1200V Full Silicon Carbide (SiC) MOSFET 2-PACK Module
ON Semiconductors has introduced 1200V full silicon carbide (SiC) MOSFET 2-PACK modules pair (NXH010P120MNF1 and NXH006P120MNF2) with superior switching performance and enhanced thermals for offering reliability and robustness in the electric vehicle (EV) market.
Gowanda Electronics’ four new internal solder-free Ceramic Wirewound Chip Inductor (CC0402, CC0603, CC0805, and CC1008) series have been released for increasing the reliability in Space/Aero programs.
Panasonic has introduced a new EEH-ZS(U) Series of (THT Tape And Box) conductive polymer hybrid aluminum capacitors that are capable of operating at high temperatures with conductive polymer capacitor performance and aluminum electrolytic capacitor safety.