Semiconductors
CFP3-HP Packaging: Space-Saving Copper Clip Design for Diode Packages
Nexperia, a global semiconductor manufacturer, introduced a lineup of 22 new planar Schottky diodes packaged in
Mornsun's LBH300-138xx: High-Efficiency Half-Brick Power Supply for Telecom Environments
MORNSUN introduced the LBH300-138xx as part of its AC/DC BRICK power supplies LBH series, focusing on high-efficiency power supply within a
New Voltage Driven Photorelays with Small Mounting Area to Reduce Semiconductor Tester Sizes
Toshiba Electronic Devices & Storage Corporation has launched three 4-Form-A voltage-driven photorelays “TLP3407SRA4,” “TLP3412SRHA4,” and “TLP3475SRHA4” that are housed in a newly-developed small S-VSON16T package and feature a typical mounting area of 12.5mm2