RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module
The RW610FML is presented as a low-power, high-performance Wi-Fi 6 and Bluetooth combo module. It supports a comprehensive range of wireless protocols, including IEEE 802.11a/b/g/…
Quectel Launches FCM665D: Wi-Fi 6 Module with Edge AI Power
Quectel Wireless Solutions has launched the FCM665D, a compact Wi-Fi 6 and Bluetooth module built specifically to bring edge AI processing into smart homes and smart building…
Quectel Launches Wi-Fi 7 & Bluetooth 6 Modules
Quectel has expanded its wireless connectivity portfolio with the FCE870X and FME170X tri-band Wi-Fi 7 modules, powered by the Synaptics SYN4384 chipset and designed for set-top…
Silicon Labs Unveils BG2B Bluetooth LE SoC for Ultra-Low-Power IoT
Silicon Labs, a leading innovator in low-power wireless connectivity, has unveiled the BG2B, its next Series 2 Bluetooth Low Energy (LE) wireless SoC. This new system-on-chip is…
Analog Devices Launches ADRF5703 Wideband Silicon
Analog Devices has significantly enhanced its RF/microwave component portfolio by introducing the ADRF5703 silicon digital attenuator. This innovative product is specifically…
Espressif ESP32-S31 RISC-V SoC Enters Mass Production
Espressif Systems (SSE: 688018) announces that its ESP32-S31 has entered mass production and is now available for purchase. Designed for next-generation AIoT applications, the…
Qorvo® Simplifies RF Control with SOI Portfolio that Eliminates Negative Bias
GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new portfolio of silicon-on-insulator (SOI…
Qorvo® Eliminates Cascaded Switches in 5G Radios with New Wideband High-Isolation Family
GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to…
Xiao ESP32-S3 IoT Development Board
Seeed Studio XIAO ESP32-S3 is an ultra-compact IoT development board built around the Espressif ESP32-S3 dual-core Wi-Fi and Bluetooth SoC. The board integrates high-performance…
PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio
CHANDLER, Ariz., January 29, 2026 — Building on decades of experience in serving embedded applications where low power, affordability and ease of development are critical,…
Redefining Connectivity: AIROC™ CYW55913 modules for IoT, Smart Home, Industrial
Ideal solution for ensuring safe operation of high-power AC/DC converters
Experience low power, high security, and reliable performance with PolarFire® Core & SoC FPGAs.
Reliable, compact NTC thermistors for higher-density designs in automotive and consumer applications
AMF60 offers 2xMOPP isolation, level VII efficiency, Class II construction for ITE & medical devices
Maximize power density using Vicor 48V power modules
Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm
Delivering high-quality RF products with precision and performance expectations for any applications