Telecom Applications
EF Series Power MOSFET with Fast Body Diode Enables High Power Density while Lowering Conduction and Switching Losses
Vishay Intertechnology, Inc has introduced a new fourth-generation 600 V EF Series fast body diode MOSFET in the low-profile PowerPAK 10 x 12 package that provides high efficiency and power density for telecom, industrial, and computing applications.
αMOS5 Super Junction MOSFETs in Small DFN8x8 Package offer Well-Balanced Footprint and Thermal Dissipation
Alpha and Omega Semiconductor Limited has announced the release of 600V 110mOhm and 140mOhm αMOS5 Super Junction MOSFETs in DFN8x8 Package that are designed to meet the high efficiency and high-density needs for Quick Charger, Adapter, PC Power, Server, Industrial Power
Ultra Low DCR Inductors with Vertical Mount Configuration for Telecom and Industrial Applications
Vishay Intertechnology has introduced a new IHVR vertical-mount inductor IHVR-4025JZ-3Z that offers high-temperature operation up to +155 °C for computer, server, telecom, and industrial applications.
New Gen 4 SiC FETs Provide Circuit Robustness and Enable New Levels of Design Flexibility
UnitedSiC has announced new 6mohm, 750V Gen 4 SiC FETs that provide a robust short-circuit and features an RDS(on) value of less than half the nearest SiC MOSFET competitor.