New Product
New CoolSiC™ MOSFETs 2000 V for Enhanced Power Density
Infineon Technology has introduced a new line of CoolSiC™ MOSFETs with a 2000 V rating in the TO-247PLUS-4-HCC package.
High-Performance Inrush Current Limiting PTC Thermistors
Vishay Intertechnology introduced its latest series of inrush current limiting positive temperature coefficient (PTC) thermistors, known as the PTCEL series
Microchip's New EEC1005-UB2 Universal Backplane Management Controller Enhances Storage Enclosure Management
Microchip Technology has introduced the EEC1005-UB2 Universal Backplane Management (UBM) controller family, designed to efficiently manage storage enclosures fo
Next-Gen Silicon Carbide Technology for High-Performance Systems
Infineon Technologies has introduced the latest generation of silicon carbide (SiC) MOSFET trench technology, known as the CoolSiC
High-Density Dual-Phase Power Modules for AI Data Centers
Infineon Technologies AG recently launched its TDM2254xD series dual-phase power modules, designed to offer superior power density,
New Industrial-Grade SMD Package Transformers: TTF-1T/2T and TTB-M-1T Series Deliver Cost-Effective Solutions for Industrial Applications
MORNSUN introduces a new line of industrial-grade SMD package transformers: the TTF-1T/2T and TTB-M-1T series. These transformers respond to the increasing industrial demand for cost-effective and efficient solutions.
3D dToF LiDAR Module with On-chip Processing Designed for Camera Assist & AV/VR Applications
STMicroelectronics has announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection and Ranging) module with 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
New Half-Bridge IGBT Power Modules for Diverse Industrial Applications
Vishay Intertechnology, Inc. introduced five new half-bridge IGBT power modules in the redesigned INT-A-PAK package.