IoT

Toshiba TXZ+ M4L Group Microcontrollers for Single-Motor Control

Microcontrollers | 2026-10-29

Toshiba Starts Mass Production of Compact Microcontrollers with Arm® Cortex®‑M4 Core

Toshiba TXZ+™ Family Entry-Class M4L Group microcontrollers, featuring an Arm Cortex-M4 core, are now in mass production for high-precision single-motor control in appliances and boosting energy.

Modules | 2026-10-01

Quectel Introduces QLM290P GNSS RTK LTE Smart Antenna at INTERGEO 2026

Quectel's QLM290P smart antenna integrates high-precision GNSS/RTK positioning, LoRa, and global LTE connectivity onto a single PCBA, streamlining development for precise autonomous applications.

Nordic Semiconductor nRF54LC10A Multiprotocol SoC

Wireless | 2026-09-30

Nordic Semiconductor Continues nRF54L Series Expansion with New Multiprotocol SoC

Nordic Semiconductor's nRF54LC10A is a new multiprotocol SoC designed for size- and cost-effective IoT devices, integrating Bluetooth LE, Thread, Zigbee, and Matter with advanced security in a…

Quectel SH603FC, SH503FM, SH803FD Smart Modules

Modules | 2026-09-26

Quecte Launches New on Device AI Smart Modules Powered by MediaTek Genio

Quectel's new SH503FM, SH603FC, and SH803FD smart modules leverage MediaTek Genio platforms for on-device AI, delivering up to 10.5 TOPS NPU performance, LPDDR5X memory, and dual display outputs for…

Ezurio BL54LM20 Series Bluetooth LE Modules with Edge AI

Wireless | 2026-09-26

Ezurio's New BL54LM20A + BL54LM20B Series Put Edge AI Within Reach of Every Bluetooth LE Developer

Ezurio BL54LM20 Series modules, based on Nordic nRF54LM20 SoCs, offer Bluetooth LE connectivity, USB, and expanded memory, with the BL54LM20B variant integrating an Axon NPU for module-level Edge AI.

Renesas SLG46801 GreenPAK Configurable Mixed-Signal IC

ICs | 2026-09-25

Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability

Renesas SLG46801 is a configurable mixed-signal IC, the smallest GreenPAK device, featuring multi-time programmability via I²C in ultra-compact WLCSP and STQFN packages for streamlined, flexible…

Nisshinbo NT1741 Ultra-Low-Current Rx Booster

Wireless | 2026-09-16

Nisshinbo New Release of the NT1741, an Ultra-Low-Current Rx Booster

Nisshinbo Micro Devices' NT1741 is an ultra-low-current Rx booster designed for 2.4 GHz wireless communication, offering 13 dB gain and 2.3 dB NF to improve receiver sensitivity and extend battery…

Qualcomm Dragonwing Q-2390 and IQ-2390 processors — Qualcomm Dragonwing Q-2390 and IQ-2390 Processors

ICs | 2026-09-02

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm's Dragonwing Q-2390 and IQ-2390 processors are highly integrated platforms bringing AI, vision, connectivity, and security to a wider range of intelligent connected edge devices.

Ezurio Veda IF912 and IF913 Wi-Fi 6/6E and Bluetooth LE 5.4 modules, featuring an integrated ARM Cortex-M33 processor. — Ezurio Veda IF912 and IF913 Wi-Fi Modules

Modules | 2026-09-01

Ezurio’s Veda IF912 and IF913: Two Wi-Fi Module families with no external Host MCU Required

Ezurio Veda IF912 and IF913 are Wi-Fi 6/6E and Bluetooth LE 5.4 modules integrating an ARM Cortex-M33 MCU, simplifying IoT designs by removing the need for an external host.

Development Boards | 2026-08-31

Arduino VENTUNO Q is Here: Bringing Agentic AI to the Physical World with Qualcomm Dragonwing IQ8 Series

Arduino VENTUNO Q is an advanced edge AI platform powered by the Qualcomm Dragonwing IQ8 Series, featuring a dual-brain architecture for agentic AI and real-time physical responses.

RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

WRIS-RSKS Series General-Purpose Thick-Film Resistors

General-purpose thick-film, anti-sulfur resistors designed for long-term performance and reliability

MAAS Series Automotive Capacitors

MAAS Series MLCCs deliver high-capacitance values, ensuring robust energy storage and performance

DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

EMI Filter Ceramic Capacitors

X2Y capacitors provide high EMI filtering and decoupling in one device, reducing parts count

DRAMs with On-Chip Error Correcting Code (ECC)

DDR3 with ECC delivers reliable data integrity through error detection and correction for systems

DuraClik 2.00 mm Wire-to-Board Connector System

Providing compact, secure connections for high-vibration use, excelling in harsh conditions

708 Series NANO²® SMD Fuse

For AI servers, hyperscale data centers, power distribution units, and high-power battery systems

IoT