ICs

Microchip MTCH3380P and MTCH3240P Turnkey Touch Controllers
Microchip MTCH3380P and MTCH3240P Turnkey Touch Controllers
ICs | 2026-10-13

Microchip Introduces its First Turnkey Touch Controllers for Buttons, Sliders and Wheels

Microchip MTCH3380P and MTCH3240P are turnkey capacitive touch controllers that integrate 12 parallel ADCs for fast, reliable HMI detection through thick materials and in noisy environments.
Qorvo QPB1055, QPA2311, QPA0018 C-Band Radar Front End Components
Qorvo QPB1055, QPA2311, QPA0018 C-Band Radar Front End Components
ICs | 2026-10-05

Qorvo® Advances C-Band Radar Front Ends with BAW-Based Frequency Agility and GaN Power

Qorvo QPB1055 BAW-switched filter bank and QPA2311/QPA0018 GaN power amplifiers deliver frequency agility and high efficiency for C-band radar front ends in pulsed ESA systems.
Renesas SLG46801 GreenPAK Configurable Mixed-Signal IC
Renesas SLG46801 GreenPAK Configurable Mixed-Signal IC
ICs | 2026-09-25

Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability

Renesas SLG46801 is a configurable mixed-signal IC, the smallest GreenPAK device, featuring multi-time programmability via I²C in ultra-compact WLCSP and STQFN packages for streamlined, flexible…
CAN Transceiver ICs and Physical Layer Guide
CAN Transceiver ICs and Physical Layer Guide
ICs | 2026-09-07

CAN Transceiver ICs and Physical Layer Guide: TJA1050, SN65HVD230, MCP2551, TJA1051, and CAN FD

A CAN Transceiver is a dedicated physical-layer interface IC that serves as the bridge between a digital CAN controller (such as the MCP2515 or the built-in CAN/TWAI peripherals inside ESP32 and STM32) and the physical differenti
Qualcomm Dragonwing Q-2390 and IQ-2390 processors
Qualcomm Dragonwing Q-2390 and IQ-2390 Processors
ICs | 2026-09-02

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm's Dragonwing Q-2390 and IQ-2390 processors are highly integrated platforms bringing AI, vision, connectivity, and security to a wider range of intelligent connected edge devices.
EPC 100V Integrated GaN Power Stage ICs in Mass Production
EPC 100V Integrated GaN Power Stage ICs in Mass Production
ICs | 2026-09-01

EPC Announces Mass Production of 100 V Integrated GaN Power Stages

Efficient Power Conversion (EPC) has released a family of 100 V integrated gallium nitride (GaN) power-stage ICs, the EPC23108, EPC23109, EPC23110, and EPC23111,  and, per the most recent coverage, moved the family into mass production.
Space CSAC-SA65 combines atomic Clock Accuracy
Space CSAC-SA65 Combines Atomic Clock Accuracy
ICs | 2026-08-28

Microchip Advances Space-Grade Timing with Enhanced Radiation Tolerance

Explore Microchip’s CSAC-SA65, a radiation-tolerant atomic clock for space systems, offering at least 30 kRad tolerance and operation from –40°C to +80°C.
KTS1642QGDV-TR AUTOMOTIVE LOAD SWITCH WITH OVP
KTS1642QGDV-TR AUTOMOTIVE LOAD SWITCH WITH OVP
ICs | 2026-08-17

Kinetic Technologies Introduces KTS1642Q Automotive Load Switches Designed to Simplify Compliance with ISO

AEC-Q100 Qualified 6A Load Switches Operate with 4.0V Cold Crank, Protecting Automotive Electronics from -28V Reverse Battery, 35V Load Dump, Over-Voltage, and Electrical Transients San Jose…
New 600V/3.0A Three-Phase Motor Driver IC ECN30626
New 600V/3.0A Three-Phase Motor Driver IC ECN30626
ICs | 2026-08-12

Minebea Power Semiconductor Device Launches New 600V/3.0A Three-Phase Motor Driver IC ECN30626

MinebeaMitsumi’s ECN30626 is a 600V, 3A three-phase motor driver IC for BLDC fan motors, designed for air conditioners, heat pumps, and water heaters.
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
ICs | 2026-08-04

Silicon Labs Unveils BG2B Bluetooth LE SoC for Ultra-Low-Power IoT

Silicon Labs introduces BG2B, its lowest-power Bluetooth LE SoC, delivering advanced security, Bluetooth Channel Sounding, and high integration for long-lasting IoT devices.

AIROC™ CYW55913/2/1 Connected MCU
AIROC™ CYW55913/2/1 Connected MCU

Redefining Connectivity: AIROC™ CYW55913 modules for IoT, Smart Home, Industrial

High-Performance Safety-Certified Capacitors
High-Performance Safety-Certified Capacitors

Ideal solution for ensuring safe operation of high-power AC/DC converters

PolarFire® Core FPGAs and SoC FPGAs
PolarFire® Core FPGAs and SoC FPGAs

Experience low power, high security, and reliable performance with PolarFire® Core & SoC FPGAs.

NCU03 Series 0201 NTC Thermistors
NCU03 Series 0201 NTC Thermistors

Reliable, compact NTC thermistors for higher-density designs in automotive and consumer applications

AMF60 60 W Wall-Mount Power Supplies
AMF60 60 W Wall-Mount Power Supplies

AMF60 offers 2xMOPP isolation, level VII efficiency, Class II construction for ITE & medical devices

Vicor‘s high performance power modules
Vicor‘s high performance power modules

Maximize power density using Vicor 48V power modules

Tactile Switches
Tactile Switches

Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm

Precision RF
Precision RF

Delivering high-quality RF products with precision and performance expectations for any applications