Upgrading its EasyDUAL CoolSiC MOSFET modules, Infineon Technologies has released two new aluminum nitride (AIN) ceramic that enable increased power density and more compact designs.
Infineon Technologies has introduced the F3L11MR12W2M1_B74, a new EasyPACK 2B module to its 1200V family. The module is integrated with CoolSiC MOSFETs, TRENCHSTOP IGBT7 devices, and an NTC temperature sensor along with PressFIT contact technology pins.