Space Applications

Infineon Technologies AG has introduced new radiation-hardened (rad hard) 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvol

Littelfuse, Inc.

Microchip Technology has introduced a new family of

VPT, Inc.

C&K has developed the Space Splice 4 Ways series High Reliability Connectors which are ideal for applications in aerospace systems, specifically

Efficient Power Conversion (EPC) has added EPC7014, a 60 V, 340 mΩ, 4 APulsed, rad-hard eGaN FET to a new family of radiation-hardened gallium nitride transistors and integrated circuits.

The Thermopad Temperature Variable Attenuator, SpaceNXT K2TVA has been introduced by Smiths Interconnect for attaining gain compensation over the temperature in critical space flight applications.

Gowanda Electronics’ four new internal solder-free Ceramic Wirewound Chip Inductor (CC0402, CC0603, CC0805, and CC1008) series have been released for increasing the reliability in Space/Aero programs.

The mmWave, surface mount interdigital PSF42B04S filter from RFMW has a passband of 40.0 to 44.0 GHz with a characteristic impedance of 50Ω.

Toshiba Electronics Devices and Storage Corporation has introduced the TLP4590A, a 1-Form-B (normally closed) photo relay with a 60V OFF-state output terminal voltage rating. The new device offers high ON-state current rating of 1.2A in a DIP6 package.