NXP's RW610FML is a compact, low-power wireless module integrating Wi-Fi 6, Bluetooth LE 5.4, and a 260MHz Arm Cortex-M33 MCU with secure EdgeLock, ideal for smart home, industrial, and IoT devices.
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
Silicon Labs introduces BG2B, its lowest-power Bluetooth LE SoC, delivering advanced security, Bluetooth Channel Sounding, and high integration for long-lasting IoT devices.
Diodes Incorporated has introduced its automotive-grade 3D Hall effect sensor, the AH4930Q, designed to improve how modern cars detect motion and position.
Kyoto, Japan, February 12, 2025 - Nuvoton Technology Corporation Japan (NTCJ) has developed new industrial 17-cell BM-ICs “KA49701A” and “KA49702A” for 48V batteries. Mass production starts from April 2025.
In this article lets us understand the basics of RTC, where it is used and for what applications, and finally take a deep dive into the types of RTCs used in electronics.