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Quectel Expands RG660Qx 5G Module Capabilities
Quectel Expands RG660Qx 5G Module Capabilities

Quectel Expands RG660Qx 5G Module Capabilities for Future Railway Mobile Communication

Quectel RG660Qx 5G module, built on Qualcomm X85/X82, is an LGA format Sub-6GHz platform designed for Future Railway Mobile Communication System (FRMCS) evaluation and railway applications.
Qualcomm Dragonwing Q-2390 and IQ-2390 processors
Qualcomm Dragonwing Q-2390 and IQ-2390 Processors

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm's Dragonwing Q-2390 and IQ-2390 processors are highly integrated platforms bringing AI, vision, connectivity, and security to a wider range of intelligent connected edge devices.
Ezurio Veda IF912 and IF913 Wi-Fi 6/6E and Bluetooth LE 5.4 modules, featuring an integrated ARM Cortex-M33 processor.
Ezurio Veda IF912 and IF913 Wi-Fi Modules

Ezurio’s Veda IF912 and IF913: Two Wi-Fi Module families with no external Host MCU Required

Ezurio Veda IF912 and IF913 are Wi-Fi 6/6E and Bluetooth LE 5.4 modules integrating an ARM Cortex-M33 MCU, simplifying IoT designs by removing the need for an external host.
Nordic Semiconductor nRF93M1 smart modem module, a compact, pre-certified solution for global Cat 1 bis IoT applications.
Nordic Semiconductor nRF93M1 Smart Modem Module

Nordic Semiconductor Takes the nRF93M Offering Developers an Easy, Pre-certified path Towards Cat 1 bis IoT

Nordic Semiconductor's nRF93M1 smart modem module provides a pre-certified, global-band solution for Cat 1 bis IoT, streamlining development and deployment across diverse markets with integrated…
Arm® Cortex®-M4 Core for Single-Motor
Arm® Cortex®-M4 Core for Single-Motor

Toshiba Starts Mass Production of Compact Microcontrollers with Arm® Cortex®-M4 Core for Single-Motor Control Applications

Toshiba's TXZ+ Family Entry-Class M4L Group microcontrollers, built on an 80MHz Arm Cortex-M4 core, enable high-precision, energy-efficient single-motor control in compact designs for next-gen.
RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module
RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module

RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module

NXP's RW610FML is a compact, low-power wireless module integrating Wi-Fi 6, Bluetooth LE 5.4, and a 260MHz Arm Cortex-M33 MCU with secure EdgeLock, ideal for smart home, industrial, and IoT devices.
ESP32-S31 Now in Mass Production and Available for Purchase
ESP32-S31 Now in Mass Production and Available for Purchase

Espressif ESP32-S31 RISC-V SoC Enters Mass Production

Shanghai, China Espressif Systems (SSE: 688018) announces that its ESP32-S31 has entered mass production and is now available for purchase. Designed for next-generation AIoT applications, ESP32-S31…
Efinix Ti180 FPGA LPDDR4x
Efinix Ti180 FPGA LPDDR4x

Efinix Launches Ti180 FPGA with Embedded LPDDR4x Memory for High-Speed AI Systems

Efinix has launched a new Titanium Ti180J484D1 FPGA, now featuring 2 GB of embedded LPDDR4x memory.
Best Circuit Simulation Software that You Should Try in 2025
Best Circuit Simulation Software that You Should Try in 2025

Best Circuit Simulation Softwares (Free and Paid) that You Should Try

Designing electronic circuits is a time-consuming and costly affair. So, it is important to analyze the behavior and performance of the electronic circuit before actually building a physical prototype.
MG82F6D17 Microcontroller
MG82F6D17 Microcontroller

MG82F6D17 8051 Based Low-Power Low-Cost Microcontroller

The MG82F6D17 is a single-chip microcontroller based on a high-performance 1-T architecture 80C51 CPU that executes instructions in 1~7 clock cycles (about 6~7 times the rate of a standard 8051 device)