Bluetooth

SH602FA and SE505FE smart modules combine Android 16 with integrated wireless

Modules | 2026-08-21

Quectel Launches Android 16 Smart Modules for 4G and 5G IoT Devices

The new SH602FA and SE505FE represent Quectel's move toward smart modules that combine cellular connectivity, application processing, graphics, multimedia, positioning and operating-system support in a single embedded platform.

Development Boards | 2026-08-19

ESP32C3 Mini Development Board

The ESP32-C3 Super Mini is an ultra-compact, thumb-sized ESP32C3 Mini development board powered by Espressif's single-core ESP32-C3 RISC-V SoC.

Modules | 2026-08-10

Antaira Launches LSP Series for Advanced PoE Surge Protection

Antaira Technologies, a global leader in industrial networking infrastructure, has introduced the LSP Series, a new line of multi-port Power-over-Ethernet (PoE) surge protection devic

Modules | 2026-08-05

Quectel Launches Wi-Fi 7 & Bluetooth 6 Modules

Quectel has expanded its wireless connectivity portfolio with the FCE870X and FME170X tri-band Wi-Fi 7 modul

Development Boards | 2026-03-16

Xiao ESP32-S3 IoT Development Board

Seeed Studio XIAO ESP32-S3 is an ultra-compact IoT development board built around the Espressif ESP32-S3 dual-core Wi-Fi and Bluetooth SoC.

Silicon Labs BG22L and BG24L for IoT applications

Wireless | 2025-01-30

BG22L and BG24L SoC with Bluetooth 6.0, AI Accelerator, and Channel Sounding for IoT Applications

Silicon Labs has introduced the BG22L and BG24L system-on-chips (SoCs) for cost-effective, high-performing wireless solutions for IoT applications.

Microcontrollers | 2023-12-05

Nordic Semiconductor Unveils nRF54H20 a Compact High-Performance IoT System-on-Chip with Advanced Features

Nordic Semiconductor announces the nRF54H20, the inaugural System-on-Chip (SoC) in the nRF54H Series, which revolutionizes IoT product development with its compact design, exceptio

Development Boards | 2022-11-07

Xiao ESP32-C3 IoT Development Board

Seeed Studio XIAO ESP32C3 is an IoT mini development board based on the Espressif ESP32-C3 WiFi/Bluetooth dual-mode chip in a very tiny form factor.

Capacitors | 2022-10-31

New Series of Surface-Mount Multilayer Ceramic Chip Capacitors Optimized for DC Blocking Applications

Vishay Intertechnology, Inc.

Modules | 2022-05-23

Type 1XL Module: Wi-Fi 6 and Bluetooth 5.3 Combo Module with High Performance Capabilities for Industrial IoT, Smart Home and Gateway Applications

Murata has announced its collaboration with NXP Semiconductors to develop the Type 1XL high-performance Wi-Fi 6 and Blu

RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

NFC FPC Antennas

NFC FPC antennas offer a compact and versatile family of antennas for two-way read/write operations

DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

Ecomate® RM Series

ecomate® RM high performance connectors are available in 8 shell sizes and 30 insert arrangements

XtremeSense™ TMR technology

Highest magnetic sensitivity, lowest power consumption, smaller size compared to Hall, AMR, and GMR

NSP/RSP Series High-Efficiency Enclosed AC/DC Power Supplies

NSP series power supplies deliver 75W–3200W high-efficiency power for industrial systems.

Tactile Switches

Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm

CH1P01xM Current Sensors

Open-loop Hall effect devices that provide a ratiometric output signal