5G

Wireless | 2026-09-04

Quectel Expands RG660Qx 5G Module Capabilities for Future Railway Mobile Communication

Quectel RG660Qx 5G module, built on Qualcomm X85/X82, is an LGA format Sub-6GHz platform designed for Future Railway Mobile Communication System (FRMCS) evaluation and railway applications.

Vishay CHEP series thin film chip resistors in 0402 and 0603 case sizes, built on aluminum nitride substrate for high power… — Vishay CHEP Series High Power Thin Film Chip Resistors

Resistors | 2026-09-04

Vishay Intertechnology’s CHEP High Frequency and High Power Thin Film Chip Resistors

Vishay CHEP series thin film chip resistors deliver industry-leading power density up to 2.8W and high-frequency performance up to 50 GHz in compact 0402 and 0603 case sizes, optimizing RF designs.

SH602FA and SE505FE smart modules combine Android 16 with integrated wireless

Modules | 2026-08-21

Quectel Launches Android 16 Smart Modules for 4G and 5G IoT Devices

The new SH602FA and SE505FE represent Quectel's move toward smart modules that combine cellular connectivity, application processing, graphics, multimedia, positioning and operating-system support in a single embedded platform.

Qorvo's New RF Switches for Next-Gen 5G Radios

Switches | 2026-06-04

Qorvo® Eliminates Cascaded Switches in 5G Radios with New Wideband High-Isolation Family

GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to simplify multi-band radio architectures.

Modules | 2024-06-28

ST4SIM-300: Flexible Embedded SIM to Support Bulk IoT Device Management

STMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA s

Misc. | 2024-05-31

QPA9822: High Gain and High Linearity Pre-Driver for 5G MIMO Systems

Qorvo has announced the new gain pre-driver QPA9822, providing 39dB gain at 3.5 GHz and achieving a peak power of +29dBm.

Capacitors | 2024-02-20

Compact High-Q 100V MLCC for Consumer Electronics and Industrial Applications

Murata recently expanded its line of monolithic ceramic chip capacitors by introducing the GJM022 series, a compact yet high-performing capacitor for high-speed 5G communication systems.

News | 2023-12-29

MORNSUN's VCB_SBO-200W(F)R3(-N) Series - High-Power Density DC/DC Converter for 5G Industry

MORNSUN unveiled the VCB_SBO-200W(F)R3(-N) series, a 1/16 brick high-power density DC/DC converter designed for the rapi

Misc. | 2022-11-01

Low-distortion and High-gain Low Noise Amplifier Series for 5G Base Station Applications

Nisshinbo Micro Devices Inc.

Capacitors | 2022-10-31

New Series of Surface-Mount Multilayer Ceramic Chip Capacitors Optimized for DC Blocking Applications

Vishay Intertechnology, Inc.

RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

WRIS-RSKS Series General-Purpose Thick-Film Resistors

General-purpose thick-film, anti-sulfur resistors designed for long-term performance and reliability

MAAS Series Automotive Capacitors

MAAS Series MLCCs deliver high-capacitance values, ensuring robust energy storage and performance

DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

EMI Filter Ceramic Capacitors

X2Y capacitors provide high EMI filtering and decoupling in one device, reducing parts count

DRAMs with On-Chip Error Correcting Code (ECC)

DDR3 with ECC delivers reliable data integrity through error detection and correction for systems

DuraClik 2.00 mm Wire-to-Board Connector System

Providing compact, secure connections for high-vibration use, excelling in harsh conditions

708 Series NANO²® SMD Fuse

For AI servers, hyperscale data centers, power distribution units, and high-power battery systems

5G