New Product
STMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA s
New 1200 V Silicon Carbide Schottky Diodes Enhance Efficiency and Reliability
Vishay Intertechnology has launched a new series of Gen 3 1200 V silicon carbide (SiC) Schottky diodes, designed to improve efficienc
Qorvo Introduces New RF Multi-Chip Modules for Advanced Radar Applications
Qorvo has introduced three new RF multi-chip modules (MCMs) designed for advanced radar applications. These modules are compact, high-performing, and energy-efficient, suitable for phased array and multifunction radar systems.
Infineon’s Radiation-Hardened Ferroelectric-RAM Devices for Space Applications
Infineon Technologies AG has introduced new radiation-hardened (rad hard) 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvol
Automotive High-Side Power Switch with Intelligent Fuse Protection and SPI Interface
STMicroelectronics has started producing automotive high-side power switches with advanced features like intelligent fuse protection and a serial peripheral interface (SPI) for diagnostic data, which enhances resilience and functional safety.
New "K" Series Pinned DC/DC Converters with Up to 30W Power Rating and Wide Input Ranges
RECOM introduces the latest "K" series of pinned DC/DC converters, featuring up to a 30W power rating and wide input ranges in a compact 1” x 1” x 0.4” package. This series includes the
New High-Density 2-in-1 SiC Molded Modules for xEV Traction Inverters
ROHM introduces the TRCDRIVE pack™ series, which includes four models of SiC molded modules designed for xEV traction inverters. These modules are optimized to handle power outputs of up to 300kW.