Processor

Digital ICs | 2026-10-07

EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet

EdgeCortix RAIDEN is a scalable AI chiplet platform purpose-built for Physical AI, offering a unified, energy-efficient architecture that scales from single to four compute dies (RAIDEN-X4) with up.

Quectel SH603FC, SH503FM, SH803FD Smart Modules

Modules | 2026-09-26

Quecte Launches New on Device AI Smart Modules Powered by MediaTek Genio

Quectel's new SH503FM, SH603FC, and SH803FD smart modules leverage MediaTek Genio platforms for on-device AI, delivering up to 10.5 TOPS NPU performance, LPDDR5X memory, and dual display outputs for…

Qualcomm Dragonwing Q-2390 and IQ-2390 processors — Qualcomm Dragonwing Q-2390 and IQ-2390 Processors

ICs | 2026-09-02

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm's Dragonwing Q-2390 and IQ-2390 processors are highly integrated platforms bringing AI, vision, connectivity, and security to a wider range of intelligent connected edge devices.

Development Boards | 2026-08-31

Arduino VENTUNO Q is Here: Bringing Agentic AI to the Physical World with Qualcomm Dragonwing IQ8 Series

Arduino VENTUNO Q is an advanced edge AI platform powered by the Qualcomm Dragonwing IQ8 Series, featuring a dual-brain architecture for agentic AI and real-time physical responses.

Misc. | 2022-06-03

New Sitara Processors with Edge AI Capabilities Reduce Power Consumption and Enable Support for HMI Applications

Texas Instruments has introduced the new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications.

News | 2021-06-21

NXP i.MX 8M Mini processor based Embedded system-on-module with built-in Video Processing Unit (VPU)

Digi International announced the expansion of its ConnectCore family of products with the introduction of the

FinFET Technology-Based Automotive Processors

News | 2021-06-03

High Performing 16nm FinFET Technology-Based New Automotive Processors Released for Radar and Vehicle Networking

Continuing to deliver the improved performance and rigorous automotive process qualifications to deliver safe next-generation computing power, NXP Semiconductors has announced the release of two new advanced processors,

News | 2021-05-19

QSXM Solder-down Module with i.MX8M Mini ARM Cortex-A53 64-bit Processors for Unparalleled Miniaturization, Thermal Efficiency, and EMI Minimization

KaRo Electronics has introduced the QSXM, a QFN-style solder-down system-on-module series with NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory, and power manageme

Modules | 2020-05-26

MPU9250 9-axis Digital Motion Processor

MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One die houses the 3-Axis gyroscope and the 3-Axis accelerometer.

RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

WRIS-RSKS Series General-Purpose Thick-Film Resistors

General-purpose thick-film, anti-sulfur resistors designed for long-term performance and reliability

MAAS Series Automotive Capacitors

MAAS Series MLCCs deliver high-capacitance values, ensuring robust energy storage and performance

DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

EMI Filter Ceramic Capacitors

X2Y capacitors provide high EMI filtering and decoupling in one device, reducing parts count

DRAMs with On-Chip Error Correcting Code (ECC)

DDR3 with ECC delivers reliable data integrity through error detection and correction for systems

DuraClik 2.00 mm Wire-to-Board Connector System

Providing compact, secure connections for high-vibration use, excelling in harsh conditions

708 Series NANO²® SMD Fuse

For AI servers, hyperscale data centers, power distribution units, and high-power battery systems