QSXM Solder-down Module with i.MX8M Mini ARM Cortex-A53 64-bit Processors for Unparalleled Miniaturization, Thermal Efficiency, and EMI Minimization
KaRo Electronics has introduced the QSXM, a QFN-style solder-down system-on-module series with NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory, and power management. With 29mm square and a height of 2.6mm, the edge-contact QFN-type pinout style features a 1mm pitch with 108 pads providing unparalleled miniaturization, thermal efficiency, and EMI minimization.
The I.MX8M family processor of the QSXM module provides a quad-core 1600MHz ARM Cortex-A53 processor complex as well as a separate GPU and Video Codec. The I.MX8M Mini combines low energy operation with powerful features including a MIPI-DSI display of up to 1080p. With an industrial temperature range of -25°C to +85°C and the module features a wide range of connectivity including UARTs, SPI, I²C, Audio, Gb Ethernet, SD, USB Host and Client, and MIPI-DSI display.
Features of QSXM Solder-down System-on-Module
- NXP i.MX 8M Mini: Quad Cortex-A53 up to 1.6 GHz; Cortex-M4 up to 400 MHz
- RAM: 2 GB LPDDR4
- ROM: 4 GB eMMC
- Grade: Industrial
- Temperature: -25°C to 85°C
- Display support: MIPI DSI (4-lane); GC328 2D GPU; GCNanoUltra 3D GPU; 1080p60 video de-/encode
Note: More technical information can be found in the QSXM Module Datasheet linked at the bottom of this page and on the product page of QSXM Solder-down System-on-module.
