Murata's New Module Enhances IoT Connectivity with Dual Support for Wi-Fi 6 and Matter
Murata, a prominent electronics manufacturer, recently showcased its latest engineering innovations at Embedded World 2023 in Nuremberg, Germany.
NXP
M.2 Cards with Wi-Fi and Bluetooth Modules for Wireless Connectivity Options
u‑blox has introduced a set of Wi-Fi 5, Wi-Fi 6, and Bluetooth expansion cards that plug into NXP Semiconductors’ i.MX processor evaluation kits.
High Performing 16nm FinFET Technology-Based New Automotive Processors Released for Radar and Vehicle Networking
Continuing to deliver the improved performance and rigorous automotive process qualifications to deliver safe next-generation computing power, NXP Semiconductors has announced the release of two new advanced processors,
Ultra-Low IQ PMIC Powers iMX8M Nano for Delivering High Performance in Embedded Artists Industrial Control Boards
ROHM Semiconductors has announced that Embedded Artists is using the BD71847AMWV, a highly integrated PMIC from ROHM along with NXP’s i.MX 8M Nano processor on its iMX8M Nano uCOM board.
New Wi-Fi 6 devices use Wi-Fi 6E Tri-Band Chipset for Increased Capacity, Reliability, and Improved Latency in Access Devices
NXP Semiconductors is laying the foundation for a new era of Wi-Fi 6 devices that operate in the 6GHz band with the help of the CW641 WiFi 6E Tri-Band System-on-chip (SoC). The ne
BlueBox 3.0 – Third Generation Development Platform for Safe Automotive High-Performance Computing
BlueBox 3.0, a new and expanded Automotive High-Performance Compute (AHPC) development platform from NXP Semiconductors allows the developers to accelerate the system development cycle and speed time t
New Radar Sensor Chipset Solutions with 4D Imaging Radar to Identify and Classify the Surrounding Vehicles
NXP Semiconductors has introduced new radar sensor chipset solutions that can surround vehicles in a 360-degree safety cocoon and allow the imaging radar to identify and classify
LDMOS Technology-based Airfast Power Multi-Chip Modules (MCMs) for High Output Power, Efficiency, and Extended Frequency Coverage
NXP Semiconductors has introduced AFSC5G26E38, 2nd generation comprehensive Airfast RF power Multi-Chip Modules (MCMs) for supporting the evolution of 5G mMIMO active antenna system
High Performance, Low Power, and Long Range Dual Band WiFi-6 and Bluetooth/BLE Solutions for Gaming, Audio, Industrial, and IoT Applications
NXP Semiconductors has announced the launch of 2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions for advanced gaming, audio, industrial, and IoT markets.
NXP S32G Vehicle Network Processor for advanced Edge to Cloud Analytics
NXP Semiconductors has introduced S32G vehicle network processors that enable the automotive industry to shift to higher-performance domain-based vehicle architectures and provide reduced software complexity and enhance security and safety. The p
1555F Series enclosures have several innovative features that provide excellent functionality
The 4:1 input JMR03 provides 2 x MOPP for BF and CF rated applications with 2µA leakage current.
Amphenol Communications Solutions connectors are tailored for emerging product designs
3M™ TwinAx High Speed Cable Solutions: Thin, low profile cable with extremely tight bend radii
EPC’s EPC2152 a chip-scale LGA form factor device that measures only 3.9 mm x 2.6 mm x 0.8 mm
Microchip's AVR DB family of microcontrollers is designed for demanding analog applications
This makes it easier to implement noise suppression with an optimal footprint and low BOM cost.
Amphenol RF's AUTOMATE Type A Mini-FAKRA quad-port jack is designed with a compact, modular housing
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