STMicroelectronics has released two new STPOWER modules that use ST’s ACEPACK 2 package technology to ensure high power density and contain 1200V silicon-carbide (SiC) MOSFETs in popular
STMicroelectronics has introduced the new third-generation Bluetooth System-on-Chip (SoC) BlueNRG-LPS which uses Bluetooth-specified technology including both angle-o