High Performance BL5340 Bluetooth 5.2 Module for Low Power Advanced Applications
Laird Connectivity has launched the BL5340 Series of Bluetooth 5.2 and 802.15.4 modules<
SoC
OceanMedallion Wearable Devices with WiRa Technology for Enhanced User Experience
Dialog Semiconductor has announced to deliver its WiRa-enabled solution to enhance Carnival Corporation’s OceanMedallion wearable devices for proximity-based locationing to help ensure passenger safety and offer enhanced cruise services.
DA914X-A PMICs Portfolio for Automotive AI SoCs Features Dynamic Voltage Control and Multi-Phase Operation
Dialog Semiconductor plc has introduced the “DA914X-A” product family of efficient, high current, automotive grade, step down DC-DC (Buck) converters for powering graphics or AI embedded processors used in machine learning and vision applications for next-generation aut
New ESP32-H2 SoC with Integrated IEEE 802.15.4 Radio and Bluetooth 5.2 (LE) Connectivity
Espressif Systems Co., Ltd. has announced the release of ESP32-H2 with integrated IEEE 802.15.4 radio and Bluetooth 5.2 (LE) connectivity, operable in the 2.4 GHz band.
New Wi-Fi 6 devices use Wi-Fi 6E Tri-Band Chipset for Increased Capacity, Reliability, and Improved Latency in Access Devices
NXP Semiconductors is laying the foundation for a new era of Wi-Fi 6 devices that operate in the 6GHz band with the help of the CW641 WiFi 6E Tri-Band System-on-chip (SoC). The ne
R-Car V3U ASIL D SoC Offers 60 TOPS with Low Power Consumption for Accelerating ADAS and Automated Driving Development Process
Renesas Electronics has introduced the R-Car V3U, a best-in-class ASIL D system on chip (SoC) for advanced driver assistance systems (ADAS) and automated driving (AD) systems.
STM32WL: Dual-Core Sub-GHZ Wireless System-on-Chip (SoC) for Multi-protocol and Long-Range Communications
STMicroelectronics has introduced the STM32WL long-range sub-GHZ wireless System on chip (SoC) family for providing flexible configurations and package options for diverse mass-market applications.
nRF21540 – RF Wireless SoC Module with Superior Link Budget for Long Range Applications
Nordic Semiconductor has announced the new nRF21540 RF Front Module (FEM) with the aim to boost the link budget of Nordic’s nRF52 and nRF53 Series multi-protocol wireless SoCs.
nRF5340 - Dual Arm Cortex-M33 Processor with Bluetooth 5.1, Bluetooth Mesh, NFC, Thread and Zigbee for Low Power IoT Applications
Nordic Semiconductor has announced nRF5340, a Dual Arm Cortex-M33 Processor, and a high-end multiprotocol SoC with a fully programmable, ultra low power network processor.
Redefining Connectivity: AIROC™ CYW55913 modules for IoT, Smart Home, Industrial
Ideal solution for ensuring safe operation of high-power AC/DC converters
Experience low power, high security, and reliable performance with PolarFire® Core & SoC FPGAs.
Reliable, compact NTC thermistors for higher-density designs in automotive and consumer applications
AMF60 offers 2xMOPP isolation, level VII efficiency, Class II construction for ITE & medical devices
Maximize power density using Vicor 48V power modules
Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm
Delivering high-quality RF products with precision and performance expectations for any applications