AI

CSU M-CRPS Series Power Supplies (3200W, 3600W)

Modules | 2026-10-23

Advanced Energy Launches 3200 W and 3600 W M-CRPS Power Supplies

Advanced Energy's new CSU M-CRPS Series, including CSU3600AT-9-3M0 and CSU3200AT-3-6M0/CSU3200ADC-3-3M0, are high-density 3200W and 3600W power supplies for AI and data centers.

TDK InvenSense PositionSense 9-Axis Sensor Solution

Sensors | 2026-10-19

TDK PositionSense™ offers 'Smart Perception’ for wearables

TDK InvenSense PositionSense is a 2-chip, 9-axis sensor solution designed for 'Smart Perception,' enabling ultimate positioning accuracy and reliable navigation even without satellite connectivity.

Digital ICs | 2026-10-12

Efinix® Brings 64-Bit RISC-V Performance With New Sapphire™ RV64 SoC

Efinix Sapphire RV64 SoC is a new 64-bit RISC-V processor core for FPGAs, providing a high-performance, configurable, and low-power solution for embedded Linux and edge AI workloads.

Renesas TP65H020G4PLSGBD 650V GaN Dual-Side Cooled Device

MOSFET | 2026-10-10

Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package

Renesas TP65H020G4PLSGBD is the industry's first 650V GaN device with dual-side cooling in an 8x8mm package, engineered for high-density power conversion in megawatt-scale AI data centers.

Digital ICs | 2026-10-07

EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet

EdgeCortix RAIDEN is a scalable AI chiplet platform purpose-built for Physical AI, offering a unified, energy-efficient architecture that scales from single to four compute dies (RAIDEN-X4) with up.

Modules | 2026-09-29

Quectel Launches SE200ZC-AP Smart Module Bringing AI-Powered Vision

On 21 September 2026 in Belgrade, Serbia, Quectel Wireless Solutions announced the SE200ZC-AP, a new smart module designed to provide manufacturers with a faster route to AI-enabled cameras, industri

Molex VersaBeam Mini 16-Fiber Expanded Beam Optical Connector

Connectors | 2026-09-28

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects AI Data Center

Molex VersaBeam Mini is an ultra-compact 16-fiber Expanded Beam Optical (EBO) connector, providing 3x density improvement and 16-fiber granularity for next-gen AI data centers.

AAEON MAX-Q870A and MAX-H810A Micro-ATX Motherboards

Modules | 2026-09-17

AAEON Release Micro-ATX Duo with Intel Core Ultra Desktop Processors

AAEON MAX-Q870A and MAX-H810A are Micro-ATX industrial motherboards featuring Intel Core Ultra 200S Series processors, offering robust solutions for AI, machine vision, and industrial automation with…

Renesas Gen 3 MRDIMM DDR5 memory chipset supporting 16,000 MT/s for AI and HPC

ICs | 2026-07-31

Renesas Gen 3 MRDIMM Chipset Boosts DDR5 Speed to 16,000 MT/s

TOKYO, Japan — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line…

New DrMOS technology delivers industry-leading peak-to-peak current limiting, ensuring safe and reliable operation for high-demand AI workloads

Power ICs | 2026-05-02

Alpha and Omega Semiconductor Unveils SmartClamp™ Protected DrMOS Family for AI Servers and High-End GPUs

SUNNYVALE, Calif., April 30, 2026 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management IC