EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet
EdgeCortix, a leading Japanese fabless semiconductor company, has unveiled RAIDEN™, its next-generation scalable AI chiplet platform. This platform is purpose-built to address the…
Quectel Launches SE200ZC-AP Smart Module Bringing AI-Powered Vision
On 21 September 2026 in Belgrade, Serbia, Quectel Wireless Solutions announced the SE200ZC-AP, a new smart module designed to provide manufacturers with a faster route to AI-…
Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects AI Data Center
Molex introduced VersaBeam Mini on September 21, 2026, as an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector. It is designed to address critical space, thermal, and…
AAEON Release Micro-ATX Duo with Intel Core Ultra Desktop Processors
AAEON has announced the release of two new Micro-ATX industrial motherboards, the MAX-Q870A and MAX-H810A. These boards feature Intel® Core™ Ultra 200S Series Processors,…
Renesas Gen 3 MRDIMM Chipset Boosts DDR5 Speed to 16,000 MT/s
Renesas Electronics Corporation, a leading supplier of advanced semiconductor solutions, has unveiled its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line Memory Module…
Alpha and Omega Semiconductor Unveils SmartClamp™ Protected DrMOS Family for AI Servers and High-End GPUs
SUNNYVALE, Calif., April 30, 2026 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL) a designer, developer, and global supplier of a broad range of discrete power…
Renesas RZ/G3E 64-Bit MPU with Cortex-A55 and AI Acceleration Targets Industrial HMI Applications
Renesas has released its new RZ/G3E 64-bit microprocessor unit (MPU). It’s a 64-bit general-purpose device optimized for Human-Machine Interface (HMI) applications. The chip is…
Efinix Launches Ti180 FPGA with Embedded LPDDR4x Memory for High-Speed AI Systems
Efinix has launched a new Titanium Ti180J484D1 FPGA, now featuring 2 GB of embedded LPDDR4x memory. This integrated memory design simplifies PCB layout by removing the need for…
ST1VAFE3BX Chip: Advanced Biosensor with High Precision Biopotential Detection and AI Core for Healthcare Innovation
STMicroelectronics has developed a new biosensing chip for the next generations of healthcare industry. This ST1VAFE3BX chip combines a high-accuracy biopotential input with…
Popular Development Boards for AI and Machine Learning
As AI and machine learning (ML) applications continue to grow, development boards have evolved to provide powerful platforms that simplify the integration of AI into various…
Redefining Connectivity: AIROC™ CYW55913 modules for IoT, Smart Home, Industrial
Ideal solution for ensuring safe operation of high-power AC/DC converters
Experience low power, high security, and reliable performance with PolarFire® Core & SoC FPGAs.
Reliable, compact NTC thermistors for higher-density designs in automotive and consumer applications
AMF60 offers 2xMOPP isolation, level VII efficiency, Class II construction for ITE & medical devices
Maximize power density using Vicor 48V power modules
Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm
Delivering high-quality RF products with precision and performance expectations for any applications