New TPHR7404PU Power MOSFET With Low-Spike Capability Reduces EMI in Switching Power Supply Applications
Toshiba has launched a 40V, N-channel MOSFET “TPHR7404PU” with low-spike capability and the latest generation U-MOSI
EMI
QSXM Solder-down Module with i.MX8M Mini ARM Cortex-A53 64-bit Processors for Unparalleled Miniaturization, Thermal Efficiency, and EMI Minimization
KaRo Electronics has introduced the QSXM, a QFN-style solder-down system-on-module series with NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory, and power manageme
Johanson's complete development kit for RF chipsets and applications solutions
The ECX-1637B is a low-aging crystal. This component is ideal for wireless and IoT applications.
AlphaWire introduces the EcoCable Mini Cable: the smallest solution to your biggest cable problems
The ACS71240 is designed to replace shunt resistors in applications that require small size.
1555F Series enclosures have several innovative features that provide excellent functionality
22-bit and 14-bit GPIO expanders with SPI interface and integrated voltage level translators
InnoSwitch3-EP family of off-line CV/CC QR flyback switcher ICs feature 900 V PowiGaN switches.
Industry leading RF performance for low-power IoT, smart home, medical & wearables
