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EMI

Low-Spike-Type TPHR7404PU Power MOSFET
Low-Spike-Type TPHR7404PU Power MOSFET

New TPHR7404PU Power MOSFET With Low-Spike Capability Reduces EMI in Switching Power Supply Applications

Toshiba has launched a 40V, N-channel MOSFET “TPHR7404PU” with low-spike capability and the latest generation U-MOSI
Dura-Con Micro-D Top Entry EMI Backshells
Dura-Con Micro-D Top Entry EMI Backshells

Nickel and Cadmium Plated Dura-Con Micro-D Top Entry EMI Backshells for Enhancing Mechanical and Electrical Durability

The Dura-Con Micro-D Top Entry EMI Backshells from Cinch Connectivity Solutions is available in both plug and socket configurations for eight standard micro-d sizes.
QSXM Solder-down System-on-Module
QSXM Solder-down System-on-Module

QSXM Solder-down Module with i.MX8M Mini ARM Cortex-A53 64-bit Processors for Unparalleled Miniaturization, Thermal Efficiency, and EMI Minimization

KaRo Electronics has introduced the QSXM, a QFN-style solder-down system-on-module series with NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory, and power manageme