The Dura-Con Micro-D Top Entry EMI Backshells from Cinch Connectivity Solutions is available in both plug and socket configurations for eight standard micro-d sizes.
KaRo Electronics has introduced the QSXM, a QFN-style solder-down system-on-module series with NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory, and power manageme