Toshiba Launches Automotive Grade 40V N-channel MOSFET
Toshiba Electronics Europe has introduced the XPJ1R504PB, an advanced 40 V N-channel power MOSFET, significantly bolstering its portfolio of automotive-grade power solutions. This device is fully qualified to the stringent AEC-Q101 automotive reliability standard and is specifically engineered for modern 12 V electrical systems.
Housed in Toshiba’s proprietary surface-mount S-TOGL package, the XPJ1R504PB stands out by merging remarkably high current capabilities with exceptional thermal performance. This combination is crucial for addressing the increasing space constraints and demanding power requirements prevalent in contemporary automotive power electronics.
As the automotive industry rapidly progresses towards electrification, there is a growing need for high-power components that deliver higher power within limited space while simultaneously enhancing conversion efficiency. The XPJ1R504PB is purpose-built to meet these challenges, serving as a vital addition to Toshiba’s S-TOGL product family and offering design engineers the flexibility to optimize power performance across a wide range of demanding automotive applications.
Specifications
| Product | Type | Qualification | Package | Continuous Drain Current (ID) | On-State Resistance (RDS(on)) | Transient Thermal Impedance (Rth(ch-c)) |
|---|---|---|---|---|---|---|
| XPJ1R504PB | 40 V N-channel power MOSFET | AEC-Q101 | S-TOGL | 120 A | 1.54 mΩ (at VGS=10V) | 0.76°C/W |
Key Features
- Automotive-grade, qualified to AEC-Q101 reliability standard.
- 40 V N-channel power MOSFET designed for 12 V automotive electrical systems.
- Housed in Toshiba’s proprietary S-TOGL surface-mount package.
- Offers a high continuous drain current of 120 A.
- Features a low on-state drain-to-source resistance (RDS(on)) of 1.54 mΩ (at VGS=10V).
- Provides exceptional thermal performance with a thick copper lead frame.
- Achieves a low transient thermal impedance of 0.76°C/W.
- Enhances mechanical strength and thermal dissipation through innovative packaging.
- Enables increased safe operating currents and simplified thermal management in ECUs.
- Addresses space constraints and improves conversion efficiency in automotive designs.
Applications
- Traction and Auxiliary Motor Drives
- Inverters
- Semiconductor Relays
- Load Switches
