Enhanced EconoDUAL 3 Portfolio with New Current Ratings for Increased Power Density and Performance
Infineon Technologies AG has enhanced its 1200V EconoDUAL 3 portfolio with the TRENCHSTOP IGBT7 chip by offering new current ratings from 300A to 900A. The broad range of current offers inverter designers a high degree of flexibility while also providing increased power density and performance. The EconoDUAL 3 with the TRENCHSTOP IGBT7 chip is based on the new micro-pattern trench technology and performs with much lower static losses compared to the modules with an IGBT4 chipset. These new devices are suitable to be used in solar, drive applications, commercial, construction, and agricultural vehicles (CAV), and for uninterruptible power supply (UPS) inverters.
The EconoDUAL 3 portfolio with the TRENCHSTOP IGBT7 chip features a maximum overload junction temperature of 175°C and its on-state voltage is reduced by up to 30% for the same chip area. With the extended 750A and 900A versions, the EconoDUAL 3 package addresses an improved inverter power range. In addition, the PressFIT housing enables a fast and cost-efficient assembly. Moreover, the oscillation behavior and the controllability of the IGBT too have been improved and the chip dimensions are tailored to enable optimization of the module layout for a reduction in switching losses which leads to a simplified design-in for applications with higher switching frequency.
Features
-
Highest power density
-
Tvj op = 175°C overload
-
PressFIT control pins and screw power terminals
-
Integrated NTC temperature sensor
-
Isolated baseplate
-
Compact and robust design with molded terminals
-
solderable press-fit auxiliary terminals
Applications
-
Commercial, construction and agricultural vehicles (CAV)
-
Motor control and drives
-
Solutions for solar energy systems
-
Uninterruptible Power Supply (UPS)
Availability
The 1200 V TRENCHSTOP IGBT7 EconoDUAL 3 portfolio is available from company website and its variants with pre-applied TIM will be made available soon.
