Edge AI

Digital ICs | 2026-10-12

Efinix® Brings 64-Bit RISC-V Performance With New Sapphire™ RV64 SoC

Efinix Sapphire RV64 SoC is a new 64-bit RISC-V processor core for FPGAs, providing a high-performance, configurable, and low-power solution for embedded Linux and edge AI workloads.

Digital ICs | 2026-10-07

EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet

EdgeCortix RAIDEN is a scalable AI chiplet platform purpose-built for Physical AI, offering a unified, energy-efficient architecture that scales from single to four compute dies (RAIDEN-X4) with up.

Quectel SH603FC, SH503FM, SH803FD Smart Modules

Modules | 2026-09-26

Quecte Launches New on Device AI Smart Modules Powered by MediaTek Genio

Quectel's new SH503FM, SH603FC, and SH803FD smart modules leverage MediaTek Genio platforms for on-device AI, delivering up to 10.5 TOPS NPU performance, LPDDR5X memory, and dual display outputs for…

Ezurio BL54LM20 Series Bluetooth LE Modules with Edge AI

Wireless | 2026-09-26

Ezurio's New BL54LM20A + BL54LM20B Series Put Edge AI Within Reach of Every Bluetooth LE Developer

Ezurio BL54LM20 Series modules, based on Nordic nRF54LM20 SoCs, offer Bluetooth LE connectivity, USB, and expanded memory, with the BL54LM20B variant integrating an Axon NPU for module-level Edge AI.

OMNIVISION OAX7700 AI Companion Processor

Digital ICs | 2026-09-24

OMNIVISION Introduces OAX7700 AI Companion Processor for Vehicle Security Systems

OMNIVISION's OAX7700 AI companion processor enables ultralow-power, always-on vehicle security by integrating an NPU for edge AI, reducing power consumption by 97% for parking surveillance.

Ezurio Today Announces the Carbon AM67 OSM-MF System-on-Module

Modules | 2026-09-12

Ezurio New Carbon AM67: A Secure and Powerful OSM-MF SOM Based on TI AM67x SoC

Ezurio Carbon AM67 OSM-MF SOM integrates TI AM67x for secure, high-performance Edge AI and HMI applications, featuring Wi-Fi 6, Bluetooth LE, and up to 4 TOPS deep learning acceleration.

Qualcomm Dragonwing Q-2390 and IQ-2390 processors — Qualcomm Dragonwing Q-2390 and IQ-2390 Processors

ICs | 2026-09-02

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm's Dragonwing Q-2390 and IQ-2390 processors are highly integrated platforms bringing AI, vision, connectivity, and security to a wider range of intelligent connected edge devices.

| 2026-08-31

Jetson Thor Modules Draw Less Power. How Should Edge AI Power BOMs Be Reevaluated?

In July 2026, NVIDIA released two new modules: the Jetson T3000 and T2000. The T3000 delivers 865 FP4 TFLOPS and includes 32GB of LPDDR5X. Its size and power consumption are about half of the T5000. The T2000 offers 400 FP4 TFLOPS and 16GB of memory.

Development Boards | 2026-08-31

Arduino VENTUNO Q is Here: Bringing Agentic AI to the Physical World with Qualcomm Dragonwing IQ8 Series

Arduino VENTUNO Q is an advanced edge AI platform powered by the Qualcomm Dragonwing IQ8 Series, featuring a dual-brain architecture for agentic AI and real-time physical responses.

Sensors | 2026-08-25

TDK Announces Expansion of TDK SensEI Edge Intelligence Portfolio with Launch of edgeRX PRO Sensor Module

**TDK Corporation** (TSE:6762) today announced the launch of the **TDK SensEI** **edgeRX PRO**, a new high-performance sensor node that expands its predictive maintenance platform, **edgeRX**…

RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

WRIS-RSKS Series General-Purpose Thick-Film Resistors

General-purpose thick-film, anti-sulfur resistors designed for long-term performance and reliability

MAAS Series Automotive Capacitors

MAAS Series MLCCs deliver high-capacitance values, ensuring robust energy storage and performance

DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

EMI Filter Ceramic Capacitors

X2Y capacitors provide high EMI filtering and decoupling in one device, reducing parts count

DRAMs with On-Chip Error Correcting Code (ECC)

DDR3 with ECC delivers reliable data integrity through error detection and correction for systems

DuraClik 2.00 mm Wire-to-Board Connector System

Providing compact, secure connections for high-vibration use, excelling in harsh conditions

708 Series NANO²® SMD Fuse

For AI servers, hyperscale data centers, power distribution units, and high-power battery systems