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embedded SIM

SLM97 – Miniaturized industrial-grade eSIM for M2M applications
SLM97 – Miniaturized industrial-grade eSIM for M2M applications

SLM97 – Miniaturized industrial-grade eSIM for M2M applications

With a dimension of only 2.5mm×2.7mm, Infineon Technologies has launched an industrial-grade embedded SIM (eSIM) in a Wafer-level- Chip-scale Package (WLCSP) which it claims to be the first of its kind in the industry.