Skip to main content

SLM97 – Miniaturized industrial-grade eSIM for M2M applications

SLM97 – Miniaturized industrial-grade eSIM for M2M applications

With a dimension of only 2.5mm×2.7mm, Infineon Technologies has launched an industrial-grade embedded SIM (eSIM) in a Wafer-level- Chip-scale Package (WLCSP) which it claims to be the first of its kind in the industry. The eSIM aims to provide reliable Machine-to-Machine communication for data collection and uninterrupted data transmission. The device comes in a small footprint providing designers more flexibility and simplifying the manufacturing process.


The SLM product family offers 16-bit and 32-bit security controllers optimized for industrial (machine-to-machine) M2M applications. This family offers exceptional endurance over an extended temperature range (-40 to 105°C) to suit difficult environmental and usage conditions such as smart metering, vending machines or asset tracking. Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator. The SLM97 family has a wide range of products, the features of the high -end performance eSIM SLM97CSINFX8000PE is shown below


Features of SLM97XX eSIM:

  • 32-bit ARM SecureCore SC300 processor
  • Upto 1MB solid flash
  • Interfaces: I2C, ISO7816, SPI, SWP
  • NVM: 800.0 kB
  • RAM: 32kB
  • Package: VQFM-32-13


The SLM 97 security chip in WLCSP is manufactured at Infineon’s production site in Dresden and Regensburg and now available in volume quantities. You can visit their product page for more information and documents.