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Data Center

Renesas TP65H020G4PLSGBD 650V GaN Dual-Side Cooled Device
Renesas TP65H020G4PLSGBD 650V GaN Dual-Side Cooled Device

Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package

Renesas TP65H020G4PLSGBD is the industry's first 650V GaN device with dual-side cooling in an 8x8mm package, engineered for high-density power conversion in megawatt-scale AI data centers.
Microchip PAC1761 and PAC1861 Digital Power Monitors
Microchip PAC1761 and PAC1861 Digital Power Monitors

48V Power Systems with Energy-Aware Digital Power Monitoring from Microchip

Microchip PAC1761 and PAC1861 digital power monitors provide energy-aware monitoring for 48V systems, offering 65V measurement, 75V spike protection, and real-time insights for enhanced efficiency.
Molex VersaBeam Mini 16-Fiber Expanded Beam Optical Connector
Molex VersaBeam Mini 16-Fiber Expanded Beam Optical Connector

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects AI Data Center

Molex VersaBeam Mini is an ultra-compact 16-fiber Expanded Beam Optical (EBO) connector, providing 3x density improvement and 16-fiber granularity for next-gen AI data centers.
Renesas Gen 3 MRDIMM DDR5 memory chipset supporting 16,000 MT/s for AI and HPC
Renesas Gen 3 MRDIMM DDR5 memory chipset supporting 16,000 MT/s for AI and HPC

Renesas Gen 3 MRDIMM Chipset Boosts DDR5 Speed to 16,000 MT/s

TOKYO, Japan — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In-Line…