Bluetooth LE

Nordic Semiconductor nRF54LC10A Multiprotocol SoC
Nordic Semiconductor nRF54LC10A Multiprotocol SoC
Wireless | 2026-09-30

Nordic Semiconductor Continues nRF54L Series Expansion with New Multiprotocol SoC

Nordic Semiconductor's nRF54LC10A is a new multiprotocol SoC designed for size- and cost-effective IoT devices, integrating Bluetooth LE, Thread, Zigbee, and Matter with advanced security in a…
Ezurio BL54LM20 Series Bluetooth LE Modules with Edge AI
Ezurio BL54LM20 Series Bluetooth LE Modules with Edge AI
Wireless | 2026-09-26

Ezurio's New BL54LM20A + BL54LM20B Series Put Edge AI Within Reach of Every Bluetooth LE Developer

Ezurio BL54LM20 Series modules, based on Nordic nRF54LM20 SoCs, offer Bluetooth LE connectivity, USB, and expanded memory, with the BL54LM20B variant integrating an Axon NPU for module-level Edge AI.
Nisshinbo NT1741 Ultra-Low-Current Rx Booster
Nisshinbo NT1741 Ultra-Low-Current Rx Booster
Wireless | 2026-09-16

Nisshinbo New Release of the NT1741, an Ultra-Low-Current Rx Booster

Nisshinbo Micro Devices' NT1741 is an ultra-low-current Rx booster designed for 2.4 GHz wireless communication, offering 13 dB gain and 2.3 dB NF to improve receiver sensitivity and extend battery…
Ezurio Today Announces the Carbon AM67 OSM-MF System-on-Module
Ezurio Today Announces the Carbon AM67 OSM-MF System-on-Module
Modules | 2026-09-12

Ezurio New Carbon AM67: A Secure and Powerful OSM-MF SOM Based on TI AM67x SoC

Ezurio Carbon AM67 OSM-MF SOM integrates TI AM67x for secure, high-performance Edge AI and HMI applications, featuring Wi-Fi 6, Bluetooth LE, and up to 4 TOPS deep learning acceleration.
RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module
RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module
Modules | 2026-08-06

RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module

NXP's RW610FML is a compact, low-power wireless module integrating Wi-Fi 6, Bluetooth LE 5.4, and a 260MHz Arm Cortex-M33 MCU with secure EdgeLock, ideal for smart home, industrial, and IoT devices.
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
Silicon Labs Unveils BG2B, Its Lowest-Power Bluetooth LE SoC with Industry-Leading Power Efficiency, Security, and Integration
ICs | 2026-08-04

Silicon Labs Unveils BG2B Bluetooth LE SoC for Ultra-Low-Power IoT

Silicon Labs introduces BG2B, its lowest-power Bluetooth LE SoC, delivering advanced security, Bluetooth Channel Sounding, and high integration for long-lasting IoT devices.

RL78/G16 16 MHz MCU for Capacitive Touch
RL78/G16 16 MHz MCU for Capacitive Touch

Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation

WRIS-RSKS Series General-Purpose Thick-Film Resistors
WRIS-RSKS Series General-Purpose Thick-Film Resistors

General-purpose thick-film, anti-sulfur resistors designed for long-term performance and reliability

MAAS Series Automotive Capacitors
MAAS Series Automotive Capacitors

MAAS Series MLCCs deliver high-capacitance values, ensuring robust energy storage and performance

DG11/DG12 Series IEC Inlet with Circuit Breaker
DG11/DG12 Series IEC Inlet with Circuit Breaker

SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker

EMI Filter Ceramic Capacitors
EMI Filter Ceramic Capacitors

X2Y capacitors provide high EMI filtering and decoupling in one device, reducing parts count

DRAMs with On-Chip Error Correcting Code (ECC)
DRAMs with On-Chip Error Correcting Code (ECC)

DDR3 with ECC delivers reliable data integrity through error detection and correction for systems

DuraClik 2.00 mm Wire-to-Board Connector System
DuraClik 2.00 mm Wire-to-Board Connector System

Providing compact, secure connections for high-vibration use, excelling in harsh conditions

708 Series NANO²® SMD Fuse
708 Series NANO²® SMD Fuse

For AI servers, hyperscale data centers, power distribution units, and high-power battery systems