RW610FML: Wi-Fi 6 and Bluetooth® LE Combo Module
NXP's RW610FML is a compact, low-power wireless module integrating Wi-Fi 6, Bluetooth LE 5.4, and a 260MHz Arm Cortex-M33 MCU with secure EdgeLock, ideal for smart home, industrial, and IoT devices.
Bluetooth LE
Silicon Labs Unveils BG2B Bluetooth LE SoC for Ultra-Low-Power IoT
Silicon Labs introduces BG2B, its lowest-power Bluetooth LE SoC, delivering advanced security, Bluetooth Channel Sounding, and high integration for long-lasting IoT devices.
Optimized with highly sensitive cap touch sensors, extensive peripheral circuits and 125℃ operation
NFC FPC antennas offer a compact and versatile family of antennas for two-way read/write operations
SCHURTER's next-generation power entry module with IEC inlet and IP67-rated circuit breaker
ecomate® RM high performance connectors are available in 8 shell sizes and 30 insert arrangements
Highest magnetic sensitivity, lowest power consumption, smaller size compared to Hall, AMR, and GMR
NSP series power supplies deliver 75W–3200W high-efficiency power for industrial systems.
Featuring packages from 3.4 x 2.4 mm with actuator heights from 0.35 up to 17 mm
Open-loop Hall effect devices that provide a ratiometric output signal