Infineon Introduces ENDOPACK™ Chip-Embedding Platform for Scalable Traction Inverter Development
Infineon Technologies AG has introduced ENDOPACK™, a new brand for advanced chip-embedding solutions. This platform extends Infineon's experience in low-voltage chip-embedding into high-voltage power electronics, providing a scalable foundation for integrating power semiconductors directly into printed circuit boards (PCBs). This approach offers automotive manufacturers greater design flexibility and opportunities to reuse inverter architectures across various vehicle platforms.
A central offering, ENDOPACK Cell, is described as the industry's first automotive-qualified, high-voltage chip-embedding solution designed for PCB integration. It directly incorporates 1200 V Automotive Gen2p CoolSiC™ MOSFET technology into the PCB structure. This enables automotive manufacturers to develop traction inverters faster and scale them across vehicle platforms, while simultaneously improving efficiency, power density, and semiconductor utilization.
ENDOPACK addresses critical industry challenges such as shortening vehicle development cycles, sustained cost pressure, and increasing demands for efficiency and power density. Unlike traditional architectures that often require new designs for individual applications, ENDOPACK Cell leverages standardized PCB design processes and proven manufacturing infrastructure to enable development cycles up to three times faster. The embedded architecture reduces inductance below 2 nH (compared to 20 nH), leading to 30 percent lower switching losses and approximately 99.5 percent efficiency under CLTC conditions. Prototype and simulation data indicate peak power density of up to 200 kW/L, with the potential to improve vehicle range by 7 percent at the vehicle level.
Source Link: Press Release
Specifications
| Platform | Semiconductor Technology | Voltage Rating | Embedded Architecture | Inductance | Switching Loss Reduction | Peak Power Density | Potential Vehicle Range Improvement |
|---|---|---|---|---|---|---|---|
| ENDOPACK Cell | Automotive Gen2p CoolSiC™ MOSFET | 1200 V | Direct integration into PCB structure | Below 2 nH compared with 20 nH | 30 percent lower | Up to 200 kW/L | 7 percent at vehicle level |
Key Features
- Advanced chip-embedding platform: ENDOPACK is Infineon's new category trademark for advanced PCB chip-embedding technologies.
- Automotive-qualified solution: ENDOPACK Cell is the industry's first automotive-qualified, high-voltage chip-embedding solution designed for PCB integration.
- Integrated semiconductor technology: Incorporates 1200 V Automotive Gen2p CoolSiC™ MOSFET technology directly into the PCB.
- Direct PCB embedding: Power semiconductors are embedded directly into the PCB structure instead of being placed on top of a substrate.
- Reduced inductance: Enables inductance below 2 nH compared with 20 nH.
- Lower switching losses: Results in 30 percent lower switching losses.
- High efficiency: Achieves approximately 99.5 percent efficiency under CLTC conditions.
- High power density: Prototype and simulation data indicate peak power density of up to 200 kW/L.
- Vehicle-range improvement potential: Has the potential to improve vehicle range by 7 percent at the vehicle level.
- Faster development cycles: Enables development cycles up to three times faster than conventional solutions.
- Flexible chip configuration: Offers freedom to adapt chip quantity and placement, and integrate multiple cells into one PCB.
- Design-agnostic production: Production lines remain design-agnostic, supporting rapid iteration without continuous manufacturing-process adaptations.
Applications
- Automotive traction inverters: Designed to help automotive manufacturers develop traction inverters faster.
- Electric vehicle power electronics: Extends chip-embedding technology into high-voltage power electronics for automotive applications.
- Automotive inverter platforms: Supports the development and scaling of inverter platforms across vehicle programs.
- Multiple vehicle platforms: Its flexible architecture enables inverter designs to be reused and adapted across different vehicle platforms.
- Different power classes: Addresses applications requiring various power classes through adaptable chip quantity and placement.
- Vehicle-specific power stages: Multiple cells can be integrated into one PCB to configure power stages according to individual vehicle-platform requirements.
- Next-generation vehicle architectures: Supports design reuse across vehicle generations, reducing engineering effort and supporting long-term platform scalability.
Avaliablity
Infineon states that its ENDOPACK™ Cell chip-embedding solution is ready for mass production, with vehicles powered by the technology planned to enter mass production in 2027. The platform integrates 1200 V Automotive Gen2p CoolSiC™ MOSFET technology directly into the PCB structure and is designed to support scalable automotive traction inverter development.
