EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet
EdgeCortix, a leading Japanese fabless semiconductor company, has unveiled RAIDEN™, its next-generation scalable AI chiplet platform. This platform is purpose-built to address the system challenges of Physical AI, where machines perceive, reason, and act in the real world, requiring compute, memory capacity, memory bandwidth, connectivity, and software to scale together. RAIDEN extends EdgeCortix's energy-efficient design into a new performance class, meeting the demands of Physical AI deployed outside centralized data centers.
RAIDEN introduces a unified, energy-efficient architecture that scales from a single compute die to a four-die flagship (RAIDEN-X4) within one hardware and software platform. This modular chiplet architecture allows for configurations like single-die (X1), two-die (X2), and four-die (X4), all sharing EdgeCortix’s DNA-X® accelerator architecture and MERA™ software stack. This common architecture enables customers to address varying performance, power, and deployment requirements while preserving their software investment.
Designed for "Physical AI at the thick edge," RAIDEN targets high-performance AI systems deployed closer to machines, sensors, and operational environments. The RAIDEN-X4 flagship is architected to operate its four compute dies as a tightly integrated system, delivering high performance for demanding Physical AI applications. Customer design wins have already been secured across various sectors, demonstrating the platform's immediate market relevance.
Source Link: Press Release
Specifications
| Product | Function | AI Compute (FP4) | Memory | Memory Bandwidth | Die-to-Die Bandwidth | Chip-to-Chip Connectivity | Key Differentiators |
|---|---|---|---|---|---|---|---|
| RAIDEN-X4 (Flagship) | Scalable AI Chiplet Platform for Physical AI | Up to 3.36 PFLOPS (3,360 TFLOPS) | Up to 256 GB | 548 GB/s | Up to 1.54 TB/s (Aggregate) | Up to 6.4 Tb/s (Scale-out) | Unified, energy-efficient architecture; modular chiplet design; common software stack (MERA); runtime-reconfigurable DNA-X; purpose-built for Physical AI at the thick edge |
Key Features
- Unified, energy-efficient architecture scaling from a single die to a four-die flagship.
- Modular chiplet architecture supporting single-die (X1), two-die (X2), and four-die (X4) configurations.
- At maximum scale (RAIDEN-X4), delivers up to 3.36 PFLOPS of FP4 AI compute.
- RAIDEN-X4 offers up to 256 GB of memory and 548 GB/s of memory bandwidth.
- Provides up to 1.54 TB/s of aggregate die-to-die bandwidth for the RAIDEN-X4.
- Features up to 6.4 Tb/s of chip-to-chip scale-out connectivity for scaling beyond a single package.
- Includes configurable power settings for diverse performance and deployment requirements.
- Integrates the latest DNA-X® accelerator architecture, featuring runtime-reconfigurable advantages and micro-code programmable matrix and vector engines.
- Utilizes the MERA™ software stack, providing a common development and deployment environment across the RAIDEN family and product generations.
- Designed to execute full Physical AI workloads, including perception, reasoning, application processing, and control.
- Enables customers to move across RAIDEN configurations while preserving software investment and application environment.
- Already secured customer design wins, demonstrating market readiness.
Applications
- Next-generation aerospace and defense systems.
- Robotic platforms.
- High-performance edge AI servers.
- Intelligent and autonomous machines.
- Intelligent manufacturing.
- Telecommunications.
- Edge AI infrastructure.
Avalaibility
The RAIDEN™ scalable AI chiplet platform from EdgeCortix is currently available through its Early Access Program, which is open to qualified customers and ecosystem partners. Customer sampling is expected to begin in early 2027, with volume production planned for the second half of 2027. Customers interested in engaging with the platform ahead of general production can register for the Early Access Program and explore the RAIDEN product for additional platform details and specifications.
