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Ezurio New Carbon AM67: A Secure and Powerful OSM-MF SOM Based on TI AM67x SoC

Ezurio Today Announces the Carbon AM67 OSM-MF System-on-Module
Ezurio Today Announces the Carbon AM67 OSM-MF System-on-Module

Ezurio, a global leader in embedded compute and connectivity, has announced the Carbon AM67 OSM-MF System-on-Module (SOM). This secure, rugged, and highly configurable platform is engineered to meet the demands of commercial, industrial, and medical Human-Machine Interface (HMI) applications.

Built upon the Texas Instruments (TI) AM67x processor family, the Carbon AM67 integrates powerful heterogeneous multiprocessing with advanced AI acceleration. It also features robust connectivity through Ezurio's Sona™ TI351 wireless module, which incorporates TI's CC3351 Wi-Fi 6® and Bluetooth® LE companion IC. The SOM further includes TI's TPS65224 PMIC, LPDDR4 RAM, and eMMC storage within a compact 45 × 30 mm OSM-MF v1.2 standard form factor, ensuring scalability, flexibility, and design longevity.

A key differentiator for the Carbon AM67 is Ezurio’s EZ BSP (Board Support Package), which builds security into the product from design through field deployment and provides a Chain of Trust with secure boot and secure signing. This platform delivers leading-edge computing performance, including tablet-class GPU power, on-device AI acceleration with up to 4 TOPS of deep learning performance, and an advanced vision pipeline, all within the proven OSM-MF form factor. It is also noted as the industry's first AM67-based SOM to integrate TI Wi-Fi.

Specifications

Product Processor Form Factor Wireless Connectivity AI Performance GPU Performance Display Support CPU Cores Temperature Range OS Support
Carbon AM67 TI AM67x family 45 × 30 mm OSM-MF v1.2 Ezurio Sona TI351 (TI CC3351 Wi-Fi 6 & Bluetooth LE) Up to 4 TOPS 50 GFLOPs (OpenGL ES 3.2, Vulkan 1.2) Up to 3 independent (3840 × 1080) 4x 1.4 GHz Arm Cortex-A53, 3x 800 MHz Arm Cortex-R5F Commercial (0 to +70°C) or Industrial (–40 to +85°C) Yocto Linux, Buildroot, FreeRTOS

Key Features

  • Built on the Texas Instruments (TI) AM67x processor family.
  • Integrates Ezurio's Sona™ TI351 wireless module, featuring TI's CC3351 Wi-Fi 6® & Bluetooth® LE companion IC.
  • Compact 45 × 30 mm OSM-MF v1.2 standard form factor for scalability and flexibility.
  • Includes TI's TPS65224 PMIC, LPDDR4 RAM (4 GB or 8 GB configurable), and eMMC storage.
  • Backed by Ezurio’s EZ BSP, providing a Chain of Trust with secure boot and secure signing.
  • Offers an open-source Yocto and Buildroot foundation with long-term security releases and no vendor lock-in.
  • Supports up to three independent displays at resolutions to 3840 × 1080.
  • Features a tablet-class GPU (50 GFLOPs, OpenGL ES 3.2 and Vulkan 1.2) and hardware-accelerated 4K60 video encode/decode.
  • Equipped with a quad MIPI-CSI-2 camera interface (up to 16 virtual channels each) and a 600 MP/s image signal processor.
  • Includes two on-board Deep Learning Accelerators delivering up to 4 TOPS total for edge AI applications.
  • Features four 1.4 GHz Arm Cortex-A53 application cores and three 800 MHz Arm Cortex-R5F MCU cores.
  • Provides secure and encrypted boot, a dedicated secure enclave, and secure file storage.
  • Supports Yocto Linux, Buildroot, and FreeRTOS.
  • Configurable temperature ratings for commercial (0 to +70°C) or industrial (–40 to +85°C) environments.
  • Wireless configurations carry global certifications for worldwide deployment.

Applications

  • Demanding commercial HMI applications
  • Demanding industrial HMI applications
  • Demanding medical HMI applications
  • Machine vision applications
  • Edge AI applications
  • Industrial markets
  • IoT markets

Availability

The Ezurio Carbon AM67 OSM-MF SOM is now shipping in sample quantities, with mass-production kits and modules announced as available in October. The module is designed for demanding commercial, industrial, and medical HMI applications and combines the TI AM67x processor family with optional Wi-Fi 6 and Bluetooth connectivity, LPDDR4 memory, and eMMC storage in a compact OSM-MF form.

Component Datasheet

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