Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm Technologies, Inc. has introduced the Qualcomm Dragonwing™ Q-2390 and IQ-2390 processors, expanding its Dragonwing portfolio. These highly integrated platforms are designed to enhance accessibility to intelligent edge computing across consumer, commercial, and industrial sectors. The processors aim to integrate AI, vision, connectivity, and security into a wider array of connected devices, enabling them to process data locally for perception, analysis, and action.

The Dragonwing Q-2390 processor is the newest addition to the Dragonwing Q2 Series. It targets edge-intelligent commercial, enterprise, and consumer products that demand advanced capabilities while adhering to strict cost, power, and size constraints. This processor integrates application compute, on-device AI, camera and display support, LTE Cat 4 and GPS location, flexible wired and wireless connectivity, security, and extensive I/O capabilities into a single platform.

Conversely, the Dragonwing IQ-2390 processor marks the debut of the new Dragonwing IQ2 Series, a family of industrial edge AI processors. This series is engineered to extend intelligent computing to a broader spectrum of industrial and compute applications. The IQ-2390 combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking (TSN) to support advanced industrial systems.

Both the Q-2390 and IQ-2390 processors feature a quad-core Qualcomm® Kryo™ CPU, a Qualcomm® Adreno™ 704 GPU, and a real-time RISC-V MCU. These platforms offer support for Linux, Android, and Zephyr operating systems.

Specifications

Key Features

• The Dragonwing Q-2390 integrates application compute, on-device AI, camera and display support, LTE Cat 4, and GPS location capabilities.
• The Q-2390 provides flexible wired and wireless connectivity options, security, and extensive I/O capabilities in a single platform.
• The Dragonwing IQ-2390 combines application processing, machine vision, and AI acceleration.
• The IQ-2390 includes dual Gigabit Ethernet with Time-Sensitive Networking (TSN).
• Both processors feature a quad-core Qualcomm Kryo CPU.
• Both processors feature a Qualcomm Adreno 704 GPU.
• Both processors include a real-time RISC-V MCU.
• Both platforms support Linux, Android, and Zephyr OS.
• The IQ-2390 is designed to support operation across an extended temperature range of -30°C to +115°C.
• The IQ-2390 includes features intended to support operation in environments subject to vibration and shock.
• The processors are highly integrated platforms designed to reduce design complexity, system cost, and time-to-market.
• The IQ-2390 architecture is provided in a ruggedized package intended for demanding industrial applications.

Applications

• The Q-2390 supports retail point-of-sale systems.
• The Q-2390 supports kiosks and access control devices.
• The Q-2390 supports smart appliances, smart agriculture, and home robots.
• The Q-2390 supports fitness equipment and enterprise terminals.
• The IQ-2390 supports industrial automation, oil & gas, utilities, and energy applications.
• The IQ-2390 helps enable HMIs, PLCs, gateways, and industrial vision systems.
• The IQ-2390 supports building automation platforms and energy management solutions.

Availability

The Qualcomm Dragonwing Q-2390 and IQ-2390 SOMs are currently being shown at IFA 2026, with customer engagement underway through an early access program. Evaluation kits for both platforms are expected to be available in early 2027. The Q-2390 is available through Qualcomm’s product page, while the IQ-2390 is also listed as an early-access product.