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LDMOS Technology-based Airfast Power Multi-Chip Modules (MCMs) for High Output Power, Efficiency, and Extended Frequency Coverage

AFSC5G26E38 LDMOS Technology-based Airfast Power Multi-Chip Modules
LDMOS Technology-based Airfast Power Multi-Chip Modules

NXP Semiconductors has introduced AFSC5G26E38, 2nd generation comprehensive Airfast RF power Multi-Chip Modules (MCMs) for supporting the evolution of 5G mMIMO active antenna system requirements for cellular base stations. For accelerating the coverage of 5G, this new Airfast module family is designed based on NXP’s latest LDMOS technology that offers higher output power, extended frequency coverage, and higher efficiency.


The AFSC5G26E38 modules deliver 20% more output power compared to the previous generation and feature a power-added efficiency of 45%, which is four points higher than the previous generation for an overall reduction in the 5G network electricity consumption.


The AFSC5G26E38 can address the 5G C-band from 3.7 to 4.0 GHz and has a high level of integrations for removing complexity and eliminating multiple prototype passes while the reduction of component count helps improve yields and decrease qualification cycle time. The 2nd generation of the Airfast MCM series includes 10 devices that cover 5G frequency bands from 2.3 to 4.0 GHz from 37 to 39 dBm average output power.


Features of AFSC5G26E38

  • Frequency: 2.3 to 4.0GHz
  • Advanced high-performance in-package Doherty
  • Fully matched (50 ohm input/output, DC blocked)
  • Covers all 5G active antenna frequencies
  • Designed for low complexity analog or digital linearization systems
  • RoHs compliant


Note: More technical Information can be found in the AFSC5G26F38 Datasheet linked at the bottom of this page and on the RF power multi-chip modules (MCM) product page.

Component Datasheet

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