Infineon Sets Benchmark for AI Accelerators and Vertical Power Delivery with 2 A/mm²
Infineon Technologies AG has introduced the TDA235E5 and TDA235E0, a new family of dual-phase smart power stages. These devices are specifically engineered to meet the rapidly escalating power density demands of next-generation AI accelerators and vertical power delivery modules, addressing a critical challenge for hyperscalers and datacenter operators as they scale AI infrastructure.
The TDA235E5 and TDA235E0 integrate Infineon's advanced OptiMOS™ 6 MOSFETs and a dual-phase driver IC within a compact 6 x 6 x 0.8 mm³ package. This integration enables the family to deliver a benchmark power density exceeding 2 A/mm², establishing a new performance reference for power stages in high-current AI processor applications.
These power stages are designed to support up to 300 A peak current and 120 A total design current (TDC), making them suitable for next-generation AI xPU accelerators and conventional server CPUs in datacenter environments. They offer versatile support for both lateral and vertical power delivery configurations, providing essential design flexibility as the industry transitions towards vertical power module architectures in advanced AI processor packages.
Furthermore, the devices feature superior thermal impedance from junction to top side, which facilitates efficient integration with liquid cooling systems. When paired with Infineon's digital multiphase controllers, these power stages enable flexible and scalable multi-rail architectures, forming a key part of Infineon's comprehensive AI server power delivery ecosystem, from the grid interface to processor core rails. Engineering samples are currently available for customer evaluation.
Specifications
| Product | Peak Current | Total Design Current (TDC) | Package | Power Density |
|---|---|---|---|---|
| TDA235E5 and TDA235E0 | Up to 300 A | 120 A | 6 x 6 x 0.8 mm³ | Exceeding 2 A/mm² |
Key Features
- Dual-phase smart power stage architecture.
- Comprises the TDA235E5 and TDA235E0 devices.
- Integrates Infineon's OptiMOS™ 6 MOSFETs.
- Integrates a dual-phase driver IC.
- Utilizes a compact 6 x 6 x 0.8 mm³ package.
- Delivers benchmark power density exceeding 2 A/mm².
- Supports up to 300 A peak current.
- Supports 120 A total design current (TDC).
- Supports both lateral and vertical power delivery configurations.
- Provides superior thermal impedance from junction to top side.
- Enables efficient liquid cooling integration.
- Supports flexible, scalable multi-rail architectures when combined with Infineon's digital multiphase controllers.
Applications
- Next-generation AI accelerators.
- Vertical power delivery modules.
- High-current AI processor applications.
- Next-generation AI xPU accelerators.
- Conventional server CPUs in datacenter environments.
- Advanced AI processor packages using vertical power module architectures.
- AI server power delivery spanning from the grid interface to processor core rails.
Availability Engineering samples for TDA235E5 and TDA235E0 are now available for customer evaluation. Find more information here.
