Ezurio’s Veda IF912 and IF913: Two Wi-Fi Module families with no external Host MCU Required
Ezurio, a global leader in wireless connectivity and a Premium Partner for Infineon Technologies, has announced that its Veda IF912 and IF913 series connected MCU modules are now in stock and available. These modules are powered by Infineon's AIROC™ CYW55912 and CYW55913 chipsets, offering a breakthrough, low-power, high-performance solution that integrates next-generation Wi-Fi and Bluetooth LE capabilities.
The Veda series distinguishes itself by combining Wi-Fi 6 (or 6E), Bluetooth LE 5.4, a 192 MHz ARM Cortex-M33 application processor, and memory into a single, certified 7 × 11 mm package. This integration eliminates the need for a separate external host MCU, simplifying the design process, reducing the Bill of Materials (BOM), and accelerating time to market for IoT devices.
The Veda IF91x series supports two flexible operating modes: SoC mode, where the full application runs directly on the module, and NCP mode, where it functions as a network coprocessor alongside an existing host. This versatility, coupled with the pre-integrated and certified MCU and radio, significantly streamlines development, resulting in simpler designs, smaller board footprints, and fewer integration challenges for engineers building connected IoT products.
Specifications
| Product Series | Chipsets | Wi-Fi Standard | Bluetooth Standard | Processor | Clock Speed | Memory | Operating Modes | Package | Temp Range | Security | Certifications |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Veda IF912 & IF913 | Infineon AIROC CYW55912 & CYW55913 | Wi-Fi 6 dual-band (IF912) / Wi-Fi 6E tri-band (IF913) | Bluetooth LE 5.4 | ARM Cortex-M33 | 192 MHz | 8 MB Flash + 8 MB PSRAM | SoC, NCP | 7 × 11 × 1.4 mm SMT | –40 °C to +85 °C | WPA2/3, Secure Boot, Anti-Rollback, Hardware Key Storage | FCC, IC, CE, UKCA, RCM, MIC, KCC, Bluetooth SIG |
Key Features
- Wi-Fi 6 dual-band (IF912) or Wi-Fi 6E tri-band (IF913) + Bluetooth LE 5.4
- Integrated ARM Cortex-M33 @ 192 MHz with ultra-low power sensor hub
- Flexible SoC and NCP operating modes, powered by Infineon MODUS Toolbox
- 8 MB Flash + 8 MB PSRAM (integrated or customer-added variants available)
- Enterprise-grade security features: WPA2/3, secure boot, Anti-rollback, and hardware key storage
- Matter and IP networking support for secure cloud connectivity
- Ultra-compact 7 × 11 × 1.4 mm SMT package
- Operating temperature range of –40 °C to +85 °C
- Eliminates the need for a separate host MCU due to integrated application MCU subsystem
- Worldwide regulatory approvals including FCC, IC, CE, UKCA, RCM, MIC, KCC, and Bluetooth SIG
- Pre-certified antenna options available for simplified regulatory compliance
Applications
- IoT devices requiring advanced Wi-Fi 6 or Wi-Fi 6E connectivity
- Connected IoT products benefiting from integrated Bluetooth LE 5.4
- IoT solutions where simplified design and reduced Bill of Materials (BOM) are critical
- Devices needing a fully integrated application MCU subsystem to accelerate development
- IoT products requiring secure cloud connectivity through Matter and IP networking
- Development of ultra-low power IoT devices
- IoT applications demanding enterprise-grade security features
Availability
Ezurio’s Veda IF912 and IF913 series are now in stock and available for purchase through Ezurio’s global distribution network. Both module families integrate Wi-Fi 6/6E, Bluetooth LE 5.4, a 192 MHz ARM Cortex-M33 application processor, and memory into a compact 7 × 11 mm package, eliminating the need for an external host MCU. Development kits are also available for immediate shipment.
