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Electronically-Marked Cable Assembly Controller with EPR Supporting Protection up to 54 V for Passive USB-C Cables

EZ-PD™ CMG2 EMCA controller
EZ-PD™ CMG2 EMCA controller

Infineon Technologies AG has introduced EZ-PD™ CMG2, a USB-C Electronically-Marked Cable Assembly (EMCA) controller with enhanced features. This controller is designed to deliver robust USB-C Power Delivery (PD) solutions for applications such as Extended Power Range (EPR) USB-C, USB4, and Thunderbolt passive cables. The EZ-PD CMG2 (Cable Marker Generation 2) is a dedicated EMCA controller designed for passive non-Thunderbolt and Thunderbolt Type-C cables and supports USB-PD 3.1 and Type-C 2.1 standards. EZ-PD CMG2-based USB-C EMCA cables can handle USB4 and TBT4 data rates and up to 240 W (48 V/5 A) of power.

EZ-PD CMG2 provides integrated V BUS-to-CC short circuit protection up to 54 V and V BUS-to-V CONN short circuit protection up to 54 V. Additionally, it supports R A weakening to reduce power consumption and integrates an oscillator and IEC ESD (electrostatic discharge) protection, eliminating the need for external clock and external ESD, respectively. The new controller comes with a configurable 47-byte storage space for vendor- and cable-specific configuration data and operates within a 2.7 to 5.5 V V CONN supply range. The integrated high-voltage protection of up to 54 V on CC, V CONN1, and V CONN2 pins safeguards against accidental shorts to the high-voltage V BUS pin on the Type-C connector, providing enhanced user safety.

 

Features

  • Supports USB PD 3.1 spec

  • Supports USB -C spec version 2.1

  • Supports USB4, TBT4 and Extended Power Range (EPR) PD protocol

  • Up to 54 V protection on CC, VCONN1, and VCONN2 pins

  • 47 bytes for storing vendor- and cable-specific configuration data

  • IEC ESD protection on VCONN and CC

  • Package: 9-ball WLCSP

 

Applications

  • EPR USB-C passive cables

  • USB4 and Thunderbolt USB-C passive cables

  • EMCA

 

Availability

The EZ-PD CMG2 EMCA controller with EPR is available in a compact 9-ball Wafer-Level Chip Scale Package (WLCSP) with a footprint of 3.3 mm² and can be ordered now. 

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