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Quectel Expands RG660Qx 5G Module Capabilities
Quectel Expands RG660Qx 5G Module Capabilities

Quectel Expands RG660Qx 5G Module Capabilities for Future Railway Mobile Communication

Quectel Wireless Solutions has introduced an LGA version of its RG660Qx 5G module series, a high-performance, sub-6GHz 5G module platform. Announced on 3 August 2026, this new…
Vishay CHEP series thin film chip resistors in 0402 and 0603 case sizes, built on aluminum nitride substrate for high power…
Vishay CHEP Series High Power Thin Film Chip Resistors

Vishay Intertechnology’s CHEP High Frequency and High Power Thin Film Chip Resistors

Vishay Intertechnology, Inc. has introduced the new CHEP series, a line of thin-film chip resistors available in compact 0402 and 0603 case sizes. These resistors are built on an…
RP50-AW and RP100-FW series
RP50-AW and RP100-FW series

RECOM has Expanded its Portfolio With the New RP50-AW and RP100-FW Series

RECOM has introduced the new RP50-AW and RP100-FW series, expanding its portfolio of isolated DC/DC converters. These converter families are designed to meet the growing demand…
Vishay Common Mode Chokes ICMS2321-10 and ICMS2321-1A
Vishay Common Mode Chokes ICMS2321-10 and ICMS2321-1A

Vishay Intertechnology Introduced Two New Common Mode Chokes for High Current

Vishay Intertechnology, Inc., through its Vishay Dale brand, has introduced two new low-profile common-mode chokes, the commercial ICMS2321-10 and the Automotive Grade ICMS2321-1A…
Qualcomm Dragonwing Q-2390 and IQ-2390 processors
Qualcomm Dragonwing Q-2390 and IQ-2390 Processors

Qualcomm Introduces Dragonwing Q-2390 and IQ-2390 Processors, Expanding Access to Intelligent Connected Devices

Qualcomm Technologies, Inc. has introduced the Qualcomm Dragonwing™ Q-2390 and IQ-2390 processors, expanding its Dragonwing portfolio. These highly integrated platforms are…
TI TMCS2100-Q1 Multiaxial Coreless Hall-Effect Current Sensor
TI TMCS2100-Q1 Multiaxial Coreless Hall-Effect Current Sensor

TI Debuts New Approach to Current Sensing for Unprecedented Accuracy in HEV and EV Traction

Texas Instruments (TI) has introduced the TMCS2100-Q1, the industry’s first multiaxial coreless Hall-effect current sensor specifically designed for all hybrid electric vehicle (…
EPC 100V Integrated GaN Power Stage ICs in Mass Production
EPC 100V Integrated GaN Power Stage ICs in Mass Production

EPC Announces Mass Production of 100 V Integrated GaN Power Stages

Efficient Power Conversion (EPC) has released a family of 100 V integrated gallium nitride (GaN) power-stage ICs, the EPC23108, EPC23109, EPC23110, and EPC23111,  and, per the…
Ezurio Veda IF912 and IF913 Wi-Fi 6/6E and Bluetooth LE 5.4 modules, featuring an integrated ARM Cortex-M33 processor.
Ezurio Veda IF912 and IF913 Wi-Fi Modules

Ezurio’s Veda IF912 and IF913: Two Wi-Fi Module families with no external Host MCU Required

Ezurio, a global leader in wireless connectivity and a Premium Partner for Infineon Technologies, has announced that its Veda IF912 and IF913 series connected MCU modules are now…
Mini-Circuits GNA series GaN MMIC Power Amplifier
Mini-Circuits GNA Series GaN MMIC Power Amplifiers

Mini-Circuits has Powered-up GaN MMIC Amplifiers that Exhibit Excellent Robustness and Efficiency

Mini-Circuits has expanded its MMIC product line with the introduction of broadband-matched GaN MMIC amplifiers, designated as the GNA series. These amplifiers are engineered to…
Arduino®️ VENTUNO™ Q's dual-brain
Arduino®️ VENTUNO™ Q's dual-brain

Arduino VENTUNO Q is Here: Bringing Agentic AI to the Physical World with Qualcomm Dragonwing IQ8 Series

Introduction Arduino VENTUNO Q is an advanced edge AI platform developed by Arduino S.r.l., a subsidiary of Qualcomm Technologies, Inc. Powered by the Qualcomm Dragonwing IQ8…