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Quectel Launches Wi-Fi 7 & Bluetooth 6 Modules

Wi-Fi & Bluetooth FME170X
Wi-Fi & Bluetooth FME170X
 Wi-Fi & Bluetooth FCE870X
Wi-Fi & Bluetooth FCE870X

Quectel has expanded its wireless connectivity portfolio with the FCE870X and FME170X tri-band Wi-Fi 7 modules, powered by the Synaptics SYN4384 chipset and designed for set-top boxes, gaming devices, digital signage, VR/AR headsets, smart gateways, and other high-performance connected products.

The FCE870X and FME170X share the same high-end feature set and differ only in form factor. The FCE870X Wi-Fi 7 module uses a compact LCC package for embedded designs, while the FME170X Wi-Fi 7 module uses a compact M.2 package for modular, slot-based systems. Device makers can choose the option that best fits their platform without compromising wireless performance.

“These high-end tri-band Wi-Fi 7 modules are engineered to run across the majority of Linux and Android platforms our customers already use. By offering the same advanced feature set in two package options, we’re giving product teams more choice in selecting the form factor that best matches their design, without compromising performance,” said Delbert Sun, Vice General Manager, Product Department, Quectel Wireless Solutions.

 

Specifications

Parameter Details
Module Series FCE870X, FME170X
Wireless Standard Wi-Fi 7 (IEEE 802.11be)
Bluetooth Bluetooth 6.0
Frequency Bands 2.4 GHz, 5 GHz, 6 GHz
Additional Connectivity IEEE 802.15.4 (Thread/Zigbee) on selected variants
Peak Data Rate Up to 1200 Mbps (FCE870X); higher-performance FME170X family available
Wi-Fi Features 1024-QAM, Low Latency, Dual-Band Simultaneous (DBS)
Bluetooth Features LE Audio, BLE, Bluetooth Long Range, HADM
Operating Temperature -30°C to +85°C (FCE870X)
Form Factor Compact SMT/LCC module for embedded devices

Key Features

  • Tri-band Wi-Fi 7 support (2.4 GHz, 5 GHz, and 6 GHz)
  • Integrated Bluetooth 6.0 with LE Audio
  • IEEE 802.15.4 support for Thread and Zigbee (selected models)
  • Up to 1200 Mbps wireless throughput
  • 1024-QAM modulation for improved network efficiency
  • Low-latency wireless communication for real-time applications
  • High Accuracy Distance Measurement (HADM)
  • Dual-Band Simultaneous (DBS) operation
  • Wide operating temperature range for industrial environments
  • Compact footprint for space-constrained embedded designs
  • Optimized for Matter-enabled smart home ecosystems
  • Designed for next-generation IoT and multimedia devices

Applications

  1. Smart Home Devices
  2. IoT Gateways
  3. Industrial Automation
  4. Consumer Electronics
  5. Smart Appliances
  6. AR/VR Devices
  7. OTT Streaming Devices
  8. High-Definition Multimedia Systems
  9. Smart Displays
  10. Edge AI Devices
  11. Robotics
  12. Intelligent Building Automation

 

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