New DHXQFN Packages with Small Footprint for Standard Logic Devices

Nexperia has announced the smallest and lowest profile 14,16, 20, and 24 pin packages for standard logic devices. DHXQFN packages not only have a smaller footprint but the package also offers a 25% saving in the PCB area. This Package enables devices to be placed closer to the bypass capacitor that can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high-frequency applications since the traces between logic device and capacitor are shorter.

The DHXQFN packages measuring 2mm x 2mm (14 pin), 2mm x 2.4mm (16 pin), 2mm x 3.2mm (20 pin) and 2mm x 4mm (24 pin) and are 0.45mm high. The parts include hex inverting Schmitt-triggers; 8-bit SIPO shift registers with output latches; 4-bit dual supply translating transceivers; octal buffer/line drivers; octal bus transceivers; and 8-bit dual supply translating transceivers.

Ashish Jha, Nexperia’s product manager said that “These new packages are an example of the innovation we are bringing. Previously, incorporating large logic functions into a system with a small form factor was unthinkable. However, our new DHXQFN package enables complex functions such as 74HC595 shift registers to fit into space-sensitive applications like smartwatches, mobile devices and internet connected industrial devices.”

Features and Benefits of DHXQFN Packages

• Smallest and thinnest package in 14, 16, 20 and 24.

• Significant space savings up to 25% on a PCB area.

• 45% of space saving compared to industry standard DQFN package.

• Small footprint and thinness of the package make it conducive for space constrained applications.

• Delivers better performance due to closer placement of supply bypass capacitor C.

• Control plan in place for process, product & package

• RoHS and dark-green compliant