HPDC Series: High Power Density Chip Resistors for High Continuous and Momentary Load Applications
TT Electronics has announced the debut of its new HPDC series high power density chip resistors which use an aluminium nitride (AlN) ceramic substrate and feature large area terminations for improved thermal contact with a PCB. This new series of resistors is optimized for power management, actuator drive, and heating applications which benefit from the enhanced heat transfer from the element to the terminal. Moreover, the use of such high-power-density components saves PCB area and boosts reliability by restricting the temperature rise in the component hotspot.
The new HPDC resistors offer a high-power density solution with ratings of 2.4W in 1206 and 3.5W in 2512 footprints and short-term overload performance is also enhanced at 4.7W in 1206 and 7.7W in 2512 for five seconds, making HPDC ideal in active capacitor bleed circuits.
In addition, these resistors may be used in temperature-controlled heating applications in which the power applied is restricted only by the maximum element temperature of 155°C and the maximum termination temperature of 110°C.