Gen 3 Single-Chip QVGA Resolution ToF Sensor IC with Integrated IR Bandpass Filter Simplifies Design and Improves System Stray Light Performances
Melexis has introduced the MLX75026 image sensor IC with IRBP, an AEC-Q100 qualified QVGA time-of-flight sensor that further expands the third generation of ToF sensors from Melexis. The high integration, small size, and low power consumption of the sensor, coupled with the integration of the IR bandpass filters, enables the design of compact and cost-effective ToF cameras for automotive, industrial, and consumer applications. The MLX75026 targets automotive use cases like driver monitoring (DMS), in-cabin monitoring, gesture control, safety applications related to airbag deployment, head-up display (HUD) driver alignment, and industrial applications like automated guided vehicles (AGVs), elevator entry, and (collaborative) robotics.
MLX75026 ToF sensor IC features QVGA (320x240 pixels) resolution with a 1/4-inch optical format and supports 940 nm illumination. This sensor IC supports both 850 and 940 nm wavelength and is also available with an integrated 940nm band pass filter.
Features
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Supports both 850 and 940 nm wavelength
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Integrated 940nm narrow band pass filter in option
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QVGA (320 x 240 pixels) resolution
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High distance accuracy due to programmable modulating frequencies up to 100 MHz
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Full resolution readout up to 180 fps (distance frames in 4 phase configuration)
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1/4” optical format
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0.8 ms phase readout time
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Up to 8 raw phases per frame, per-phase statistics & diagnostics
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2 data lanes
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Region of interest (ROI) selection, integrated support for binning (2x2, 4x4, 8x8), horizontal mirror & vertical flip image modes
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Built-in temperature sensor
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Package: 9.2 x 7.8 x 1.0mm encapsulated (80 pins)
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Ambient operating temperature range -40 +105°C (ambient temperature)
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AEC-Q100 qualified (grade 2)
Applications
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Driver monitoring (DMS)
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Gesture control
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Airbag deployment
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Automated guided vehicles (AGVs)
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Robotics
Availability
Samples of the MLX75026 with IRBP filter are now available and a compact high-performance evaluation kit (EVK) will also be released.