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Fully Integrated Optical MLX75026 Time-of-Flight Image Sensor Provides High Quantum Efficiency and Distance Accuracy for Automotive and Non-Automotive Applications

MLX75026 QVGA Resolution ToF Sensor
MLX75026 QVGA Resolution ToF Sensor

Melexis has unveiled the new third-generation QVGA resolution ToF sensor completing its Gen 3 portfolio. Named MLX75026, the AEC-Q100 qualified QVGA time-of-flight sensor is half the size of the existing MLX75027 VGA 3D ToF camera sensor IC and requires just 30% of the computing power needed by the MLX75027 VGA ToF sensor. Additionally, when compared to the existing sensors, this one surpasses the predecessors in terms of quantum efficiency and distance accuracy. Additionally, it offers software-compatibility with the MLX75027 Gen 3 VGA ToF sensor, thereby facilitating migration between VGA and QVGA resolutions.  


The sensor has QVGA (320x240 pixels) resolution with a 1/4 inch optical format and supports both 850 nm and 940 nm illumination. The IC is configurable over an I2C interface and provides CSI-2 serial data output.


Delivering intrinsic robustness with respect to scenes with low contrast and strong sunlight, the sensor stands out from the crowd and can well be used for automotive applications like driver monitoring systems (DMS), hand movement, and robust gesture recognition (HMI), and in-cabin monitoring systems (IMS). The MLX75026 can easily be used for applications where reliability and availability of data is important. Furthermore, the device is targeted to be used in other markets and for applications for which QVGA resolution is adequate, including robust people counting and object/obstacle detection.


Key Features of MLX75026

  • Supports both 850 and 940 nm wavelength
  • QVGA (320x240) resolution.
  • Supports both 850 and 940 nm wavelength
  • QVGA (320 x 240 pixels) resolution
  • High distance accuracy due to programmable modulating frequencies up to 100 MHz
  • 0.7 ms phase readout time
  • Full resolution readout up to 135 fps (distance frames in 4 phase configuration)
  • 1/4” optical format
  • Up to 8 raw phases per frame, per-phase statistics & diagnostics
  • Region of interest (ROI) selection, integrated support for binning (2x2, 4x4, 8x8), horizontal mirror & vertical flip image modes
  • Built-in temperature sensor
  • Package: 9.2 x 7.8 x 1.0 mm encapsulated (80 pins)
  • Ambient operating temperature range -40 +105 °C (ambient temperature)
  • AEC-Q100 qualified (grade 2)


The samples of the MLX75026 are currently available and the evaluation kit will be made available in November 2020.

Note: More technical information can be found in the datasheet linked at the bottom of this page and in the MLX75026 product page.

Component Datasheet

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